Abstract: Apparatus for ultrasonically bonding a web of bondable material, comprising web transport means for moving the web along a web travel path, a plurality of ultrasonic bonding means disposed along the travel path, means for selectively energizing the ultrasonic bonding means, and carrier means for selectively moving the ultrasonic bonding means into intermittent bonding contact with the web during movement of the web along the travel path, such that the web is multiply untrasonically bonded during travel along said travel path by at least one of: (i) successive bonding contacts with a bonding site on the web by different ones of the plurality of ultrasonic bonding means, and (ii) simultaneous bonding contacts with a plurality of different web bonding sites by different ones of the ultrasonic bonding means. Also disclosed is a corresponding method of ultrasonically bonding a web of bondable material.