Patents by Inventor Gary N. Poli

Gary N. Poli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective electroless plating of vias in VLSI devices
    Patent number: 4692349
    Abstract: Selective electroless plating of cobalt or nickel is utilized to form conductive plugs in high-aspect-ratio vias in VLSI devices. Particularly good results are obtained when an active or catalytic film is formed on the via bottoms to serve as a plating base.
    Type: Grant
    Filed: March 3, 1986
    Date of Patent: September 8, 1987
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: George E. Georgiou, Gary N. Poli