Abstract: An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.

Abstract: A thermal conductor suitable for communicating heat from an integrated circuit to a thermal transfer device is disclosed. The thermal conductor comprises a base having a first portion and a second portion, wherein the first portion is adapted to be positioned substantially planar to and proximate the integrated circuit, and further wherein the second portion includes sidewalls that define an aperture in the body and forms a spherical cavity, and wherein the aperture is adapted to pivotally receive at least a portion of the thermal transfer device such that at least a portion of the thermal transfer device is in thermal communication with the integrated circuit.

Abstract: A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.

Abstract: A microelectronic assembly includes a component attached to a substrate by a variable thickness solder joint. The solder joint comprises a first thickness adjacent the central region of the component and a second, relatively greater thickness adjacent the perimeter region of the component. The variable thickness solder joint may be used for attaching a power die to a metal heat sink on a printed circuit board, so that the relatively thin central portion promoted thermal dissipation to maintain the die within a desired operating temperature range, and the relatively thick perimeter region distributes thermally induced stresses to enhance joint strength and reduce fatigue cracking.

Abstract: The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.

Abstract: A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.