Patents by Inventor Gary Peng
Gary Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967937Abstract: A packaged semiconductor chip includes a semiconductor sub strate having formed thereon: radio-frequency (RF) input and output contact pads, DC contact pads, and first and second amplifier stages. An input of the first amplifier stage is coupled with the RF input contact pad. An input and an output of the second amplifier stage are respectively coupled to an output of the first amplifier stage and the RF output contact pad. The DC contact pads and the input of the first amplifier stages are connected via an input bias coupling path. The outputs of the amplifier stages are connected via an output bias coupling path. The chip further includes a lead frame having RF input and output pins electrically coupled to the RF input and output contact pads, and input bias pins electrically coupled to the DC contact pad.Type: GrantFiled: January 17, 2019Date of Patent: April 23, 2024Assignee: Viasat, Inc.Inventors: Shih Peng Sun, Kenneth V. Buer, Michael R. Lyons, Gary P. English, Qiang R. Chen, Ramanamurthy V. Darapu, Douglas J. Mathews, Mark S. Berkheimer, Brandon C. Drake
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Patent number: 8030688Abstract: A method for fabricating a semiconductor device which protects the ohmic metal contacts and the channel of the device during subsequent high temperature processing steps is explained. An encapsulation layer is used to cover the channel and ohmic metal contacts. The present invention provides a substrate on which a plurality of semiconductor layers are deposited. The semiconductor layers act as the channel of the device. The semiconductor layers are covered with an encapsulation layer. A portion of the encapsulation layer and the plurality of semiconductor layers are removed, wherein ohmic metal contacts are deposited. The ohmic metal contacts are then annealed to help reduce their resistance. The encapsulation layer ensures that the ohmic metal contacts do not migrate during the annealing step and that the channel is not harmed by the high temperatures needed during the annealing step.Type: GrantFiled: June 17, 2009Date of Patent: October 4, 2011Assignee: HRL Laboratories, LLCInventors: Tahir Hussain, Miroslav Micovic, Paul Hashimoto, Gary Peng, Ara K. Kurdoghlian
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Publication number: 20090250725Abstract: A method for fabricating a semiconductor device which protects the ohmic metal contacts and the channel of the device during subsequent high temperature processing steps is explained. An encapsulation layer is used to cover the channel and ohmic metal contacts. The present invention provides a substrate on which a plurality of semiconductor layers are deposited. The semiconductor layers act as the channel of the device. The semiconductor layers are covered with an encapsulation layer. A portion of the encapsulation layer and the plurality of semiconductor layers are removed, wherein ohmic metal contacts are deposited. The ohmic metal contacts are then annealed to help reduce their resistance. The encapsulation layer ensures that the ohmic metal contacts do not migrate during the annealing step and that the channel is not harmed by the high temperatures needed during the annealing step.Type: ApplicationFiled: June 17, 2009Publication date: October 8, 2009Applicant: HRL LABORATORIES, LLCInventors: Tahir HUSSAIN, Miroslav MICOVIC, Paul HASHIMOTO, Gary PENG, Ara K. KURDOGHLIAN
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Patent number: 7566916Abstract: A method for fabricating a semiconductor device which protects the ohmic metal contacts and the channel of the device during subsequent high temperature processing steps is explained. An encapsulation layer is used to cover the channel and ohmic metal contacts. The present invention provides a substrate on which a plurality of semiconductor layers are deposited. The semiconductor layers act as the channel of the device. The semiconductor layers are covered with an encapsulation layer. A portion of the encapsulation layer and the plurality of semiconductor layers are removed, wherein ohmic metal contacts are deposited. The ohmic metal contacts are then annealed to help reduce their resistance. The encapsulation layer ensures that the ohmic metal contacts do not migrate during the annealing step and that the channel is not harmed by the high temperatures needed during the annealing step.Type: GrantFiled: October 13, 2004Date of Patent: July 28, 2009Assignee: HRL Laboratories, LLCInventors: Tahir Hussain, Miroslav Micovic, Paul Hashimoto, Gary Peng, Ara K. Kurdoghlian
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Patent number: 7449428Abstract: The present invention provides an isolated biocontrol agent, which is a strain of Pyricularia setariae. The present invention also relates to a biocontrol composition comprising at least one fungal biocontrol agent, which is a strain of Pyricularia setariae. Examples of the biocontrol agent of the present invention include Pyricularia setariae 94-409A (IDAC 190701-1), Pyricularia setariae 01-069A (IDAC 290102-01), and Pyricularia setariae 01-071A (IDAC 290102-02). Preferably, the biocontrol composition comprises an acceptable medium such as a liquid culture medium or a solid culture medium. The biocontrol agent or biocontrol composition may be used to suppress the growth of a weeds such as green foxtail (Setaria viridis [L.] Beauv.).Type: GrantFiled: April 30, 2002Date of Patent: November 11, 2008Assignee: Her Majesty The Queen in Right of Canada as represented by the Minister of Agriculture and Agri-Food Saskatoon Research CentreInventors: Gary Peng, Kelly N. Byer
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Patent number: 6884704Abstract: A method for fabricating a semiconductor device which protects the ohmic metal contacts and the channel of the device during subsequent high temperature processing steps is explained. An encapsulation layer is used to cover the channel and ohmic metal contacts. The present invention provides a substrate on which a plurality of semiconductor layers are deposited. The semiconductor layers act as the channel of the device. The semiconductor layers are covered with an encapsulation layer. A portion of the encapsulation layer and the plurality of semiconductor layers are removed, wherein ohmic metal contacts are deposited. The ohmic metal contacts are then annealed to help reduce their resistance. The encapsulation layer ensures that the ohmic metal contacts do not migrate during the annealing step and that the channel is not harmed by the high temperatures needed during the annealing step.Type: GrantFiled: August 4, 2003Date of Patent: April 26, 2005Assignee: HRL Laboratories, LLCInventors: Tahir Hussain, Miroslav Micovic, Paul Hashimoto, Gary Peng, Ara K. Kurdoghlian
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Publication number: 20050054530Abstract: The present invention provides an isolated biocontrol agent, which is a strain of Pyricularia setariae. The present invention also relates to a biocontrol composition comprising at least one fungal biocontrol agent, which is a strain of Pyricularia setariae. Examples of the biocontrol agent of the presnet invention include Pyricularia setariae 94-904A (IDAC 190701-1), Pyricularia setariae 01-069A (IDAC 290102-01), and Pyricularia setariae 01-071A (IDAC 290102-02). Preferably, the biocontrol composition comprises an acceptable medium such as a liquid culture medium or a solid culture medium. The biocontrol agent or biocontrol composition may be used to suppress the growth of a weeds such as green foxtail (Setaria viridis [L.] Beauv.).Type: ApplicationFiled: April 30, 2002Publication date: March 10, 2005Inventors: Gary Peng, Kelly Byer
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Publication number: 20050048747Abstract: A method for fabricating a semiconductor device which protects the ohmic metal contacts and the channel of the device during subsequent high temperature processing steps is explained. An encapsulation layer is used to cover the channel and ohmic metal contacts. The present invention provides a substrate on which a plurality of semiconductor layers are deposited. The semiconductor layers act as the channel of the device. The semiconductor layers are covered with an encapsulation layer. A portion of the encapsulation layer and the plurality of semiconductor layers are removed, wherein ohmic metal contacts are deposited. The ohmic metal contacts are then annealed to help reduce their resistance. The encapsulation layer ensures that the ohmic metal contacts do not migrate during the annealing step and that the channel is not harmed by the high temperatures needed during the annealing step.Type: ApplicationFiled: October 13, 2004Publication date: March 3, 2005Inventors: Tahir Hussain, Miroslav Micovic, Paul Hashimoto, Gary Peng, Ara Kurdoghlian
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Publication number: 20040029330Abstract: A method for fabricating a semiconductor device which protects the ohmic metal contacts and the channel of the device during subsequent high temperature processing steps is explained. An encapsulation layer is used to cover the channel and ohmic metal contacts. The present invention provides a substrate on which a plurality of semiconductor layers are deposited. The semiconductor layers act as the channel of the device. The semiconductor layers are covered with an encapsulation layer. A portion of the encapsulation layer and the plurality of semiconductor layers are removed, wherein ohmic metal contacts are deposited. The ohmic metal contacts are then annealed to help reduce their resistance. The encapsulation layer ensures that the ohmic metal contacts do not migrate during the annealing step and that the channel is not harmed by the high temperatures needed during the annealing step.Type: ApplicationFiled: August 4, 2003Publication date: February 12, 2004Inventors: Tahir Hussain, Miroslav Micovic, Paul Hashimoto, Gary Peng, Ara K. Kurdoghlian