Patents by Inventor Gary Philip Thomson

Gary Philip Thomson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulant barrier
    Patent number: 11807522
    Abstract: In described examples, a device mounted on a substrate includes an encapsulant. In at least one example, an encapsulant barrier is deposited along a scribe line, along which the substrate is singulatable. To encapsulate one or more terminals of the substrate, an encapsulant is deposited between the encapsulant barrier and an edge of the device parallel to the encapsulant barrier.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: November 7, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jane Qian Liu, Gary Philip Thomson, Richard Allen Richter
  • Processing an optical device
    Patent number: 11145782
    Abstract: A method for processing an integrated optical circuit chip includes securing a panel dam around a periphery of an array of integrated optical circuit chips that share a substrate. The method also includes filling an area circumscribed by the panel dam with an insulating polymer to a level below a top surface of the integrated optical circuit chips. The method further includes singulating a given integrated optical circuit chip in the array of integrated optical circuit chips.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 12, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jane Qian Liu, Gary Philip Thomson
  • ENCAPSULANT BARRIER
    Publication number: 20200339416
    Abstract: In described examples, a device mounted on a substrate includes an encapsulant. In at least one example, an encapsulant barrier is deposited along a scribe line, along which the substrate is singulatable. To encapsulate one or more terminals of the substrate, an encapsulant is deposited between the encapsulant barrier and an edge of the device parallel to the encapsulant barrier.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Jane Qian Liu, Gary Philip Thomson, Richard Allen Richter
  • Encapsulant barrier
    Patent number: 10710875
    Abstract: In described examples, a device mounted on a substrate includes an encapsulant. In at least one example, an encapsulant barrier is deposited along a scribe line, along which the substrate is singulatable. To encapsulate one or more terminals of the substrate, an encapsulant is deposited between the encapsulant barrier and an edge of the device parallel to the encapsulant barrier.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: July 14, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jane Qian Liu, Gary Philip Thomson, Richard Allen Richter
  • PROCESSING AN OPTICAL DEVICE
    Publication number: 20200212250
    Abstract: A method for processing an integrated optical circuit chip includes securing a panel dam around a periphery of an array of integrated optical circuit chips that share a substrate. The method also includes filling an area circumscribed by the panel dam with an insulating polymer to a level below a top surface of the integrated optical circuit chips. The method further includes singulating a given integrated optical circuit chip in the array of integrated optical circuit chips.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Inventors: JANE QIAN LIU, GARY PHILIP THOMSON
  • ENCAPSULANT BARRIER
    Publication number: 20190144270
    Abstract: In described examples, a device mounted on a substrate includes an encapsulant. In at least one example, an encapsulant barrier is deposited along a scribe line, along which the substrate is singulatable. To encapsulate one or more terminals of the substrate, an encapsulant is deposited between the encapsulant barrier and an edge of the device parallel to the encapsulant barrier.
    Type: Application
    Filed: November 13, 2017
    Publication date: May 16, 2019
    Inventors: Jane Qian Liu, Gary Philip Thomson, Richard Allen Richter
  • Microwave Cure of Semiconductor Devices
    Publication number: 20090253232
    Abstract: A method for curing an adhesive is disclosed. A preferred embodiment comprises securing a cover onto a substrate to enclose a MEMs device using an adhesive. The adhesive is either partially or fully cured using microwave radiation. Another preferred embodiment utilizes the microwave radiation to cure an encapsulant placed to protect a semiconductor device.
    Type: Application
    Filed: April 8, 2008
    Publication date: October 8, 2009
    Inventors: Gary Philip Thomson, Peter Joseph Sakakini