Abstract: An optoelectronic assembly which provides for enhanced alignment between the internal components thereof. The assembly includes a housing having a base portion and a cover portion, the housing including therein a circuitized substrate. A pair of optoelectronic devices (transmitter and receiver components) are initially movably (loosely) positioned within the housing. The invention utilizes an alignment member which is secured to the housing while positively engaging the movably positioned devices and precisely align these devices with respect thereto such that these devices are in turn precisely aligned with optic means (e.g., a duplex optical connector) when the optic means is positioned within the alignment member. In one embodiment, the housing is of metallic material while the alignment member is a molded plastic structure. The alignment member may also include shutter means therein for safety purposes.

Abstract: A flexible supporting cable for an electronic device which includes a steel foil substrate, a layer of polymer on portions of the substrate, circuit pads on the polymer layer having both the bottom and top surfaces of the pads exposed; circuit lines extending from the top surface of the pads, a window free from steel beneath a portion of the circuit lines, and a second, smaller window free from both steel and the polymer beneath a portion of the circuit lines. Methods are provided for fabricating these flexible supporting cables.

Abstract: A method for performing differential etching of material by using electromagnetic radiation. Material having two predetermined regions is provided. A beam of electromagnetic radiation is generated. The energy intensity of predetermined areas within the beam of electromagnetic radiation is selectively varied so that both of the predetermined regions of the material are etched simultaneously and each of the predetermined regions is etched at a rate independent of the etching rate of the other of the predetermined regions. In an alternate embodiment, a substance having at least two materials is provided. A beam of electromagnetic radiation is generated. The energy intensity of predetermined areas within the beam of electromagnetic radiation is selectively varied so that the time required to etch one of the materials is substantially equal to the time required to etch any selected combination of the materials remaining.

Abstract: In a field-accessed magnetic domain device package assembly, the magnetic domain device carrier or support, the circuit line or conductor carrier, and the magnetic bias field source are integrally and coactively provided by a common substrate member. The member is a planar permanent magnetic insulator ceramic and carries a bonded conductor or wiring pattern. The input/output (I/O) terminals of the domain device, also referred to in the art as a chip, are selectively bonded to the conductors of the pattern thereby providing mechanical support of the chip directly to the substrate in a superimposed relationship, input/output electrical connection to the chip, and mounting of the chip in close proximity to the bias field source, the flux of which passes through the superimposed mounted chips to a high permeability member at least part of which is disposed on the opposite side of the chip.

Abstract: Field accessed magnetic domain device apparatus, of the kind which employs an inner and an encompassing outer solenoid as the rotational magnetic field orthogonal drive coil members with the magnetic domain device(s) mounted within the inner solenoid, has conductive shield means disposed within the inner solenoid between the device(s) and the solenoids. This results in a substantially uniform flux distribution which passes through the inner solenoid and/or mitigation of the adverse effects of the stray flux between turns of the solenoids. As a consequence, a substantially uniform rotational magnetic field distribution is provided in the active area for the device(s), generally referred to as magnetic bubble device(s) or chip(s).