Patents by Inventor Gary R. Sutcliffe

Gary R. Sutcliffe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct metallization process
    Patent number: 5376248
    Abstract: A direct metallization process is disclosed wherein plastic substrates may be electrolytically plated without the need for any prior electroless plating. The process uses a specially formulated post-activator composition at an elevated temperature to treat the activated substrate comprising either an alkaline solution containing an effective amount of metal ions which undergo a disproportionation reaction or an alkaline solution containing a metal ion such as Cu.sup.+2.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: December 27, 1994
    Assignee: Enthone-OMI, Inc.
    Inventors: Jay B. Conrod, Gary R. Sutcliffe
  • Method for manufacture of printed circuit boards
    Patent number: 5358602
    Abstract: A method for the manufacture of printed circuit boards is provided comprising conditioning the board, activating with a catalytic metal, post-activating, stabilizing and etching the copper surfaces before the desired circuit is formed on the board. This process eliminates the need for a flash coating of copper in the through holes before the use of protective coatings such as imaging resists and soldermasks.
    Type: Grant
    Filed: December 6, 1993
    Date of Patent: October 25, 1994
    Assignee: Enthone-OMI Inc.
    Inventors: Gary R. Sutcliffe, Jay B. Conrod