Abstract: Methods and apparatus provide for a touch sensitive display, which may include: a display layer; a cover glass layer formed from ion exchanged glass; and an optional touch glass layer, where, either on a first side of the touch glass or on a first side of the cover glass, a grid of electrode traces is disposed, which is sensitive to distortions of a local electrostatic field caused by a touching event, and the grid may be positioned between the display layer and the cover glass layer.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.

Abstract: An optical finger navigation device. Embodiments of the optical finger navigation device include a light guide film (LGF) including a finger interface surface, a light source in optical communication with the LGF to provide light from the light source to the finger interface surface, a sensor, and a navigation engine. At least a portion of the LGF exhibits total internal reflection (TIR). The sensor detects light from the LGF in response to contact between a finger and the finger interface surface which modifies reflection of light out of the LGF to the sensor. The light detected by the sensor is changed over at least a portion of the sensor in response to the contact between the finger and the finger interface surface. The navigation engine is configured to generate lateral movement information indicative of lateral movement of the finger relative to the sensor, in response to the detected light.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS-compatible and other fabrication and packaging processes.

Abstract: A transceiver having a transmitting antenna, a receiving antenna, and a substrate having transmitter and receiver dies is disclosed. The transmitter generates an RF signal having a carrier frequency and the receiver detects and amplifies signals of the carrier frequency. The transmitting antenna and/or the receiving antenna includes a first wire antenna loop having a length greater than or equal to one tenth of a wavelength of the carrier frequency. The first wire antenna loop is connected to the transmitter die by a wire bond on a bond pad of the transmitter die. The antenna loop or loops can be encapsulated in an insulating material to protect the loops and fix the loops in space. The transceiver can be configured to operate as a galvanic isolator or a proximity detector.

Abstract: A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion being disposed a second surface of the substrate. The transmitter receives an input signal and couples a signal derived from the input signal to the first portion. The receiver is connected to the second portion of the circuit element and generates an output signal that is coupled to an external circuit. The galvanic isolator can be economically fabricated on conventional printed circuit board substrates and flexible circuit substrates.

Abstract: A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion being disposed a second surface of the substrate. The transmitter receives an input signal and couples a signal derived from the input signal to the first portion. The receiver is connected to the second portion of the circuit element and generates an output signal that is coupled to an external circuit. The galvanic isolator can be economically fabricated on conventional printed circuit board substrates and flexible circuit substrates.

Abstract: A method for high-volume production of light emitting diodes with attached lenses involves providing pre-fabricated lenses, wherein the pre-fabricated lenses are held by a common transfer structure, simultaneously attaching the pre-fabricated lenses to respective ones of light emitting diodes, and releasing the pre-fabricated lenses from the common transfer structure. In an embodiment, the light emitting diodes are distributed in a pattern on a common substrate and the common transfer structure is configured to hold the pre-fabricated lenses in a pattern that corresponds to the pattern of the light emitting diodes on the common substrate. Further, to attach the pre-fabricated lenses to the light emitting diodes, the common transfer structure is positioned relative to the common substrate such that the pre-fabricated lenses are aligned with the light emitting diodes.

Abstract: Disclosed herein are various embodiments of coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided through and across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. A central core layer separates the transmitting and receiving coils, and has no vias disposed therethrough. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material.

Abstract: Disclosed herein are various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another.

Abstract: A method of forming a multiple layer passivation film on a semiconductor device surface comprises placing a semiconductor device in a chemical vapor deposition reactor, introducing a nitrogen source into the reactor, introducing a carbon source into the reactor, depositing a layer of carbon nitrogen on the semiconductor device surface, introducing a silicon source into the reactor after the carbon source, and depositing a layer of silicon carbon nitrogen on the carbon nitrogen layer. A semiconductor device incorporating the multiple layer passivation film is also described.

Abstract: A transceiver having a transmitting antenna, a receiving antenna, and a substrate having transmitter and receiver dies is disclosed. The transmitter generates an RF signal having a carrier frequency and the receiver detects and amplifies signals of the carrier frequency. The transmitting antenna and/or the receiving antenna includes a first wire antenna loop having a length greater than or equal to one tenth of a wavelength of the carrier frequency. The first wire antenna loop is connected to the transmitter die by a wire bond on a bond pad of the transmitter die. The antenna loop or loops can be encapsulated in an insulating material to protect the loops and fix the loops in space. The transceiver can be configured to operate as a galvanic isolator or a proximity detector.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS-compatible and other fabrication and packaging processes.

Abstract: A method for high-volume production of light emitting diodes with attached lenses involves providing pre-fabricated lenses, wherein the pre-fabricated lenses are held by a common transfer structure, simultaneously attaching the pre-fabricated lenses to respective ones of light emitting diodes, and releasing the pre-fabricated lenses from the common transfer structure. In an embodiment, the light emitting diodes are distributed in a pattern on a common substrate and the common transfer structure is configured to hold the pre-fabricated lenses in a pattern that corresponds to the pattern of the light emitting diodes on the common substrate. Further, to attach the pre-fabricated lenses to the light emitting diodes, the common transfer structure is positioned relative to the common substrate such that the pre-fabricated lenses are aligned with the light emitting diodes.

Abstract: A method of forming a multiple layer passivation film on a semiconductor device surface comprises placing a semiconductor device in a chemical vapor deposition reactor, introducing a nitrogen source into the reactor, introducing a carbon source into the reactor, depositing a layer of carbon nitrogen on the semiconductor device surface, introducing a silicon source into the reactor after the carbon source, and depositing a layer of silicon carbon nitrogen on the carbon nitrogen layer. A semiconductor device incorporating the multiple layer passivation film is also described.

Abstract: A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion being disposed a second surface of the substrate. The transmitter receives an input signal and couples a signal derived from the input signal to the first portion. The receiver is connected to the second portion of the circuit element and generates an output signal that is coupled to an external circuit. The galvanic isolator can be economically fabricated on conventional printed circuit board substrates and flexible circuit substrates.

Abstract: A user observes an object in a visual scene and moves a user-controlled pointing device that measures magnetic fields to control or move the object. One or more magnetic sensors are included within the user-controlled pointing device and each magnetic sensor measures a magnetic field component associated with a respective orthogonal direction. A processing circuit receives an output signal from each magnetic sensor that represents the respective magnetic field component measured by that sensor. The processing circuit then tracks the movement of the pointing device using the output signals received from each magnetic sensor. Positional information for the object is determined based on the tracked movement of the user-controlled pointing device. The positional information is transmitted to a controller associated with the object using a communications link established between the pointing device and the controller.

Abstract: At least one optical waveguide is supported on a substrate and has a plurality of key apertures formed in a complaint element thereof. An optoelectronic device such as a vertical cavity surface emitting laser (VCSEL) has a plurality of projections that register with corresponding key apertures to position the optoelectronic device in a predetermined alignment relative to the optical waveguide.

Abstract: A device for storing and deploying cable, including but not limited to optical fiber cable. The device includes a substantially planar bottom support surface having juxtaposed thumb segments and an intervening finger segment. An outer wall is affixed to the bottom surface about its perimeter and extends upwardly therefrom. A substantially circular guide wall is disposed on the bottom surface extending upwardly therefrom. A substantially circular inner wall is concentrically arranged with respect to the guide wall. A top flange is joined to the support surface by the outer wall and, together with the thumb segments, form entry and exit ports for the cable. The guide wall and the inner wall define a guide track that is dimensioned so as to enable continuous adjustment of variable lengths of cable in an area of the device bounded by the guide track, the outer wall and a transverse barrier that extends the length of the finger segment.