Patents by Inventor Gary Raymond Williams
Gary Raymond Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6852241Abstract: The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.Type: GrantFiled: August 14, 2001Date of Patent: February 8, 2005Assignee: Lexmark International, Inc.Inventors: Brian Christopher Hart, Shauna Marie Leis, Gary Raymond Williams
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Patent number: 6834937Abstract: A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.Type: GrantFiled: August 13, 2002Date of Patent: December 28, 2004Assignee: Lexmark International, Inc.Inventors: Eric Louis Killmeier, Paul Timothy Spivey, Sean Terrence Weaver, Gary Raymond Williams
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Publication number: 20040032468Abstract: A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.Type: ApplicationFiled: August 13, 2002Publication date: February 19, 2004Inventors: Eric Louis Killmeier, Paul Timothy Spivey, Sean Terrence Weaver, Gary Raymond Williams
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Patent number: 6613687Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.Type: GrantFiled: March 28, 2001Date of Patent: September 2, 2003Assignee: Lexmark International, Inc.Inventors: Brian Christopher Hart, James Michael Mrvos, Carl Edmond Sullivan, Gary Raymond Williams, Qing Ming Wang
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Publication number: 20030034325Abstract: The invention provides an improved method for grit blasting slots in a silicon wafer. The method includes, providing a silicon wafer having a first surface and a second surface, the first surface containing resistive, conductive and insulative layers defining individual semiconductor components, applying a first substantially permanent non-water soluble layer selected from silane, photoresist materials and a combination of a silane layer and a photoresist layer to the first surface of the wafer to provide a first substantially permanent layer thereon, applying a water-soluble protective material to the first layer to provide a second layer, grit blasting slots in the wafer corresponding to the individual semiconductor components, and subsequently, removing the water-soluble protective layer from the wafer. The protective layer provides enhanced protection for the electrical components on a silicon wafer during a grit blasting process so that a higher yield of useable semiconductor chips may be made.Type: ApplicationFiled: August 14, 2001Publication date: February 20, 2003Inventors: Brian Christopher Hart, Shauna Marie Leis, Gary Raymond Williams
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Publication number: 20020142609Abstract: The invention provides a method for making thin film metal oxide actuator device. According to the method a first conductive layer is deposited on a silicon substrate. Next a thin film metal oxide layer is deposited on the first conductive layer. A negative photoresist material is applied to the metal oxide layer to provide a photoresist layer. The photoresist layer is patterned using light radiation energy and developed to provide one or more exposed portions of the metal oxide layer. The photoresist layer is etched with a reactive ion plasma sufficient to remove the photoresist layer and the metal oxide layer under the photoresist layer from the first conductive layer leaving the one or more exposed portions of metal oxide layer on the first conductive layer. A second conductive layer is attached to the metal oxide layer to provide a thin film metal oxide actuator device.Type: ApplicationFiled: March 28, 2001Publication date: October 3, 2002Inventors: Brian Christopher Hart, James Michael Mrvos, Carl Edmond Sullivan, Gary Raymond Williams, Qing Ming Wang
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Patent number: 6409312Abstract: The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a semiconductor substrate containing ink ejection devices and a dry-etched ink via therein. A first photo-imaged polymer layer is applied to the semiconductor substrate, the first photo-imaged polymer layer being patterned and developed to contain ink flow chambers and ink flow channels corresponding to the ink ejection devices on the semiconductor substrate. A second photo-imaged polymer layer is applied to the first photo-imaged polymer layer. The second photo-imaged polymer layer is patterned and developed to contain nozzle holes corresponding to the ink chambers in the first photo-imaged polymer layer and corresponding to the ink ejection devices on the semiconductor substrate. The invention provides increased printhead manufacturing accuracy and elimination of alignment and adhesive attachment of a separate nozzle plate to an ink jet heater chip.Type: GrantFiled: March 27, 2001Date of Patent: June 25, 2002Assignee: Lexmark International, Inc.Inventors: James Michael Mrvos, Carl Edmond Sullivan, Gary Raymond Williams
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Patent number: 6402299Abstract: An ink jet cartridge assembly for use in an ink jet printer has a body with at least one inner ink chamber. A printhead is carried by the body and has a plurality of ink jetting orifices in fluid communication with the ink chamber. A tape automated bonding circuit carried by the body includes a flexible tape and a plurality of electrical traces. The flexible tape includes a chip window with a peripheral edge. The printhead is disposed within the chip window at a distance from the peripheral edge. Each electrical trace has a bottom side adjacent the body, a substrate held portion carried by the flexible tape, a free trace portion extending between the peripheral edge of the chip window and the printhead, and a printhead held portion connected with the printhead. The tape automated bonding circuit further includes a photoimagable coating which covers the bottom side of each electrical trace on all of the substrate held portion and the free trace portion, but does not cover the printhead held portion.Type: GrantFiled: October 22, 1999Date of Patent: June 11, 2002Assignee: Lexmark International, Inc.Inventors: Jan Richard DeMeerleer, Brian Christopher Hart, James Michael Mrvos, Gary Raymond Williams
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Patent number: 6357864Abstract: The invention provides a printhead cartridge body contained within an inkjet printer which contains a tape automated bonding (TAB) circuit, having a unique architecture, electrically connected to a printhead heater chip and a printed circuit board (PCB). Moreover, the TAB circuit architecture is readily sealable by a variety of methods. The TAB circuit includes elongate apertures which have a length axis aligned perpendicular to electrical traces which run through the apertures. Each trace has a first end running through the apertures and being connected to a PCB by means of a hot bar soldering technique and the second end of the traces being connected to a printhead heater chip. An encapsulant layer substantially encloses the rectangular apertures and electrical connections preventing ink mist from contacting the connections. The TAB circuit design provides improvement in the manufacturing process and enables rework of connections without destroying the TAB circuit.Type: GrantFiled: December 16, 1999Date of Patent: March 19, 2002Assignee: Lexmark International, Inc.Inventors: Carl Edmond Sullivan, Frank Edward Anderson, Paul Timothy Spivey, Kris Ann Reeves, Gary Raymond Williams, Jeanne Marie Saldanha Singh
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Patent number: 6323456Abstract: A method for making an inkjet printhead nozzle plate from a composite strip containing a nozzle layer and an adhesive layer is disclosed. The adhesive layer is coated with a polymeric sacrificial layer prior to laser ablating the flow features in the composite strip. A method is also provided form improving adhesion between the adhesive layer and the sacrificial layer. Once the composite strip containing the sacrificial layer is prepared, the coated composite strip is then laser ablated to form flow features in the strip in order to form the nozzle plates. After forming the flow features, the sacrificial layer is removed individual inkjet printhead nozzle plate are separated from the composite strip by singulating the nozzle plates with a laser.Type: GrantFiled: May 11, 2000Date of Patent: November 27, 2001Assignee: Lexmark International, Inc.Inventors: Ashok Murthy, Tonya Harris Jackson, Steven Robert Komplin, Gary Raymond Williams
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Patent number: 6283588Abstract: A print head having an ink reservoir therein is made by forming, in a one-shot plastic injection molding step, a rigid monolithic frame including high melt temperature material having an opening therein extending from a first side to a second side, and first and second bonding surfaces surrounding the opening and facing the first and second sides, respectively. First and second thin flexible films are adhesively secured to the first and second bonding surfaces, respectively. The adhesive material may be a hot melt adhesive or dry adhesive films pre-formed to the shape of the bonding surfaces. By securing the flexible films to the bonding surfaces adhesively, rather than by heat staking, it is not necessary to form the frame of different materials during two separate molding steps.Type: GrantFiled: December 19, 2000Date of Patent: September 4, 2001Assignee: Lexmark International, Inc.Inventors: Fred Young Brandon, Robert Arnold Christiansen, Curtis Ray Droege, Lawrence Russell Steward, Gary Raymond Williams
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Patent number: 6264317Abstract: The invention relates to an ink jet pen having exposed surfaces which are coated with a polymeric material. The polymeric material is treated with ultraviolet energy at a wavelength and for a period of time sufficient to increase the surface energy of the coating to thereby enhance the adhesive properties of the coating. The coated polymeric material and treated pen exhibits improved corrosion resistance and are more compatible with adhesives used to assemble components of the pen than similar untreated coatings.Type: GrantFiled: November 19, 1999Date of Patent: July 24, 2001Assignee: Lexmark International, Inc.Inventors: Michael Raulinaitis, Jeanne Marie Saldanha Singh, Gary Raymond Williams
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Patent number: 6243117Abstract: A print head having an ink reservoir therein is made by forming, in a one-shot plastic injection molding step, a rigid monolithic frame comprising high melt temperature material having an opening therein extending from a first side to a second side, and first and second bonding surfaces surrounding the opening and facing the first and second sides, respectively. First and second thin flexible films are adhesively secured to the first and second bonding surfaces, respectively. The adhesive material may be a hot melt adhesive or dry adhesive films pre-formed to the shape of the bonding surfaces. By securing the flexible films to the bonding surfaces adhesively, rather than by heat staking, it is not necessary to form the frame of different materials during two separate molding steps.Type: GrantFiled: May 12, 1995Date of Patent: June 5, 2001Assignee: Lexmark International, Inc.Inventors: Fred Young Brandon, Robert Arnold Christiansen, Curtis Ray Droege, Lawrence Russell Steward, Gary Raymond Williams
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Patent number: 6193359Abstract: An ink jet print head having ink passage ways formed in a radiation cured resin layer which is attached to a substrate and to a phenoxy butryal surface of a nozzle plate. The passageways are connected in fluid flow communication to an ink discharging outlet provided by an orifice plate. In order to form the passage ways in the resin layer, a resin composition is exposed to a radiation source in a predetermined pattern to cure certain regions of resin layer while other regions which provide the passage ways remain uncured. The uncured regions are removed from the resin layer leaving the desired passage ways. The resin composition to be used for forming the radiation curable layers is a resin composition including: a first difunctional epoxy compound; a second multifunctional crosslinking epoxy compound; a photoinitiator; a reactive silane, and a non-photoreactive.Type: GrantFiled: April 21, 1998Date of Patent: February 27, 2001Assignee: Lexmark International, Inc.Inventors: Girish Shivaji Patil, Paul Timothy Spivey, Gary Raymond Williams
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Patent number: 6183064Abstract: A method for making an inkjet printhead nozzle plate from a composite strip containing a nozzle layer and an adhesive layer is disclosed. The adhesive layer is coated with a polymeric sacrificial layer prior to laser ablating the flow features in the composite strip. A method is also provided form improving adhesion between the adhesive layer and the sacrificial layer. Once the composite strip containing the sacrificial layer is prepared, the coated composite strip is then laser ablated to form flow features in the strip in order to form the nozzle plates. After forming the flow features, the sacrificial layer is removed individual inkjet printhead nozzle plate are separated from the composite strip by singulating the nozzle plates with a laser.Type: GrantFiled: March 28, 1997Date of Patent: February 6, 2001Assignee: Lexmark International, Inc.Inventors: Ashok Murthy, Richard Earl Corley, Tonya Harris Jackson, Steven Robert Komplin, Gary Raymond Williams
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Patent number: 6120131Abstract: A composite structure containing a nozzle layer and an adhesive layer is provided and the adhesive layer is coated with a polymeric sacrificial layer. The coated composite structure is laser ablated to form one or more nozzles in the structure and the sacrificial layer is removed. The sacrificial layer is preferably a water soluble polymer, such as polyvinyl alcohol or polyethylene oxide, which is removed by directing jets of water at the sacrificial layer until it is substantially removed from the adhesive layer.Type: GrantFiled: November 7, 1997Date of Patent: September 19, 2000Assignee: Lexmark International, Inc.Inventors: Ashok Murthy, Steven Robert Komplin, Gary Raymond Williams, Tonya Harris Jackson
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Patent number: 6106096Abstract: The invention described in the specification relates to an ink jet printhead structure having semiconductor substrate containing energy imparting devices for ejecting ink through nozzle holes in a nozzle plate, to a method for making a printhead structure and to a printer cartridge containing the printhead structure. In order to reduce stresses induced in the structure during manufacturing and/or use thereof, a polymeric layer is disposed between the semiconductor substrate and nozzle plate which contains expansion void spaces or valleys sufficient to inhibit stresses in the structure during a process for bonding the nozzle plate to the polymeric layer thereby reducing misalignment and warpage problems associated with conventional printhead structures.Type: GrantFiled: December 15, 1997Date of Patent: August 22, 2000Assignee: Lexmark International, Inc.Inventors: Steven Robert Komplin, Ashok Murthy, Michael Raulinaitis, Gary Raymond Williams
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Patent number: 5907333Abstract: This invention relates to an ink jet print head having ink passage ways formed in a radiation cured resin layer which is attached to a substrate. The passageways are connected in fluid flow communication to an ink discharging outlet provided by an orifice plate. In order to form the passage ways in the resin layer, a resin composition is exposed to a radiation source in a predetermined pattern to cure certain regions of resin layer while other regions which provide the passage ways remain uncured. The uncured regions are removed from the resin layer leaving the desired passage ways. The resin composition to be used for forming the radiation curable layers is a resin composition comprising: a first multifunctional epoxy compound; a second multifunctional compound; a photoinitiator; and a non-photoreactive solvent.Type: GrantFiled: March 28, 1997Date of Patent: May 25, 1999Assignee: Lexmark International, Inc.Inventors: Girish Shivaji Patil, Paul Timothy Spivey, Gary Raymond Williams
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Patent number: 5812158Abstract: A nozzle plate for an ink jet print head which is coated with a low surface energy polymer with the attaching surface further coated by tantalum in a thickness range of 50 to 500 Angstroms. The tantalum gives excellent attachment over a wide range of environments. A master sheet of individual nozzle plates is first coated by chemical vapor deposition and then sputter coated with tantalum on the attachment side. These are quite inexpensive and avoids the use of a more expensive gold coating.Type: GrantFiled: January 18, 1996Date of Patent: September 22, 1998Assignee: Lexmark International, Inc.Inventors: Ashok Murthy, Gary Raymond Williams