Abstract: The glass-based THz optical waveguides (10) disclosed herein are used to guide optical signals having a THz frequency in the range from 0.1 THz to (10) THz and include a core (20) surrounded by a cladding (30). The core has a diameter D1 in the range from (30) ?m to 10 mm and is made of fused silica glass having a refractive index n1. The cladding is made of either a polymer or a glass or glass soot and has a refractive index n2<n1 and an outer diameter D2 in the range from 100 ?m to 12 mm. The THz optical waveguides can be formed using processes that are extensions of either fiber, ceramic and soot-based technologies. In an example, the THz waveguides have a dielectric loss Df<0.005 at 100 GHz.

Abstract: The glass-based THz optical waveguides (10) disclosed herein are used to guide optical signals having a THz frequency in the range from 0.1 THz to (10) THz and include a core (20) surrounded by a cladding (30). The core has a diameter D1 in the range from (30) ?m to 10 mm and is made of fused silica glass having a refractive index n1. The cladding is made of either a polymer or a glass or glass soot and has a refractive index n2<n1 and an outer diameter D2 in the range from 100 ?m to 12 mm. The THz optical waveguides can be formed using processes that are extensions of either fiber, ceramic and soot-based technologies. In an example, the THz waveguides have a dielectric loss Df<0.005 at 100 GHz.

Abstract: Optical connections and optical receptacle bodies are disclosed. In one embodiment, an optical connection includes an optical chip, a receptacle body and first and second alignment pins. The optical chip includes a surface, an edge extending from the surface, and at least one optical waveguide within the optical chip and terminating at the edge. The receptacle body includes a first surface, a second surface, a first groove at the second surface, a second groove at the second surface, and a through-hole extending from the first surface to the second surface, wherein the through-hole is disposed between the first groove and the second groove. The first alignment pin is disposed on the surface of the optical chip and within the first groove of the receptacle body. The second alignment pin is disposed on the surface of the optical chip and within the second groove of the receptacle body.

Abstract: A fiber coupling device comprising a mounting substrate, at least one optoelectronic and/or photonic chip and at least one first fiber coupling element for coupling an optical fiber to the fiber coupling device is disclosed. The optoelectronic and/or photonic chip has a main surface and comprises an optoelectronic and/or photonic active element couplable to a fiber end-piece of a respective optical fiber. The fiber coupling device further comprises at least one second fiber coupling element which is designed to contact and/or engage with a fiber end-piece of an optical fiber and which is mounted to the main surface of the at least one optoelectronic and/or photonic chip in a position aligned relative to the active element.

Abstract: A method of coating a surface of a glass ribbon during a drawing process using atmospheric vapor deposition is provided. The method includes forming a glass ribbon in a viscoelastic state, desirably with a fusion draw. The glass ribbon is drawn in the viscoelastic state. The glass ribbon is cooled in the viscoelastic state into an elastic state. The glass ribbon is directed into an open end of a reactor. The reactor includes multiple channels. A first channel directs a first reactant gas, a second channel directs a second reactant gas and one or more third channels draw excess reactant, or purge it with inert gas flow, or both.

Abstract: A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

Abstract: Disclosed are transceivers using a pluggable optical body. In one embodiment the transceiver comprises a transceiver receptacle body and a substrate assembly. The transceiver receptacle body comprises a front side, a rear side and at least one optical channel at the optical interface with the front side having at least one alignment pin and the rear side having at least one cavity. The substrate assembly comprises a substrate supporting at least one active electronic component and the substrate comprising at least one alignment feature for cooperating with the at least one alignment pin of the transceiver receptacle body. In one variation, one or more alignment pins may extend from the front side into the cavity of the transceiver receptacle body.

Abstract: A fiber-bundle sub-assembly includes an array of fiber bundles each having at least one optical fiber. The fiber bundles have select relative positions in the array. The sub-assembly includes first and second connecting elements that run along the array and that are secured to axially staggered top and bottom anchors to define first and second connecting spans that cross first and second sides of the array, with the first and second sides defined by first and second sets of fiber bundles. The first and second connecting spans are respectively attached to the first and second sets of fibers bundles to maintain the select relative positions of the fiber bundles even when the connecting spans are cut near one of the anchors during processing. A loose-tube cable that includes the fiber-bundle sub-assembly and a method of connectorizing the fiber bundles while maintaining their select positions are also disclosed.

Abstract: A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

Abstract: A fiber-bundle sub-assembly includes an array of fiber bundles each having at least one optical fiber. The fiber bundles have select relative positions in the array. The sub-assembly includes first and second connecting elements that run along the array and that are secured to axially staggered top and bottom anchors to define first and second connecting spans that cross first and second sides of the array, with the first and second sides defined by first and second sets of fiber bundles. The first and second connecting spans are respectively attached to the first and second sets of fibers bundles to maintain the select relative positions of the fiber bundles even when the connecting spans are cut near one of the anchors during processing. A loose-tube cable that includes the fiber-bundle sub-assembly and a method of connectorizing the fiber bundles while maintaining their select positions are also disclosed.

Abstract: Fiber optic cable sub-assemblies having a fiber optic cable including at least one optical fiber attached to a circuit board are disclosed. The circuit board includes an active optical component in operable communication with the optical fiber for forming an active optical cable (AOC) assembly. A strain relief device attaches an end portion of the fiber optic cable to the circuit board, thereby forming the cable sub-assembly. Methods of assembling the fiber optic cable sub-assembly are also disclosed and include the step of attaching an end portion of the fiber optic cable to the circuit board.

Abstract: A fiber coupling device comprising a mounting substrate, at least one optoelectronic and/or photonic chip and at least one first fiber coupling element for coupling an optical fiber to the fiber coupling device is disclosed. The optoelectronic and/or photonic chip has a main surface and comprises an optoelectronic and/or photonic active element couplable to a fiber end-piece of a respective optical fiber. The fiber coupling device further comprises at least one second fiber coupling element which is designed to contact and/or engage with a fiber end-piece of an optical fiber and which is mounted to the main surface of the at least one optoelectronic and/or photonic chip in a position aligned relative to the active element.

Abstract: Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be used to electrically couple an electrical device to an electrical substrate, for example a printed circuit board. The out-of-substrate package structure may be electrically coupled to the electrical substrate. Ground paths of the out-of-substrate package structure may be arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device. In this regard, electric field lines generated by current flowing into the electrical device tend to terminate at the return or ground paths allowing for impedance to be more easily controlled. Accordingly, the out-of-substrate package structure may be impedance matched in a better way with respect to power provided from the electrical substrate enabling faster electrical device speeds.

Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Abstract: Methods and apparatus provide for a touch sensitive display, which may include: a display layer; a cover glass layer formed from ion exchanged glass; and an optional touch glass layer, where, either on a first side of the touch glass or on a first side of the cover glass, a grid of electrode traces is disposed, which is sensitive to distortions of a local electrostatic field caused by a touching event, and the grid may be positioned between the display layer and the cover glass layer.

Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Abstract: A method of coating a surface of a glass ribbon during a drawing process using atmospheric vapor deposition is provided. The method includes forming a glass ribbon in a viscoelastic state, desirably with a fusion draw. The glass ribbon is drawn in the viscoelastic state. The glass ribbon is cooled in the viscoelastic state into an elastic state. The glass ribbon is directed into an open end of a reactor. The reactor includes multiple channels. A first channel directs a first reactant gas, a second channel directs a second reactant gas and one or more third channels draw excess reactant, or purge it with inert gas flow, or both.

Abstract: The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Abstract: Fiber optic cable sub-assemblies having a fiber optic cable including at least one optical fiber attached to a circuit board are disclosed. The circuit board includes an active optical component in operable communication with the optical fiber for forming an active optical cable (AOC) assembly. A strain relief device attaches an end portion of the fiber optic cable to the circuit board, thereby forming the cable sub-assembly. Methods of assembling the fiber optic cable sub-assembly are also disclosed and include the step of attaching an end portion of the fiber optic cable to the circuit board.

Abstract: Controlled-impedance out-of-substrate package structures employing electrical devices and related assemblies, components, and methods are disclosed. An out-of-substrate package structure may be used to electrically couple an electrical device to an electrical substrate, for example a printed circuit board. The out-of-substrate package structure may be electrically coupled to the electrical substrate. Ground paths of the out-of-substrate package structure may be arranged proximate to the electrical device and arranged symmetric with respect to at least one geometric plane intersecting the electrical device. In this regard, electric field lines generated by current flowing into the electrical device tend to terminate at the return or ground paths allowing for impedance to be more easily controlled. Accordingly, the out-of-substrate package structure may be impedance matched in a better way with respect to power provided from the electrical substrate enabling faster electrical device speeds.