Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas.

Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

Abstract: A multi-beam phased array antenna architecture includes a plurality of antenna modules, stacked together in a side-by-side relationship. Mutually adjacent edges of the modules have antenna elements that form a two-dimensional antenna array as a result of the stacking of the antenna modules. Opposite sides of an antenna module are tray-configured and contain amplifier modules coupled to the antenna elements, and to ‘vertical’ microstrip layers on undersides of double-sided printed wiring boards. Outersides of the double-sided printed wiring boards contain ‘horizontal’ microstrip layers, one for each beam, to which multiple beam-associated phase shift circuit elements for each antenna element on the module are ported. The phase shift circuit elements are also coupled by conductive vias to the first microstrip layers. The second microstrip layers are coupled to connectors along second edges of the modules for engagement with beam signal network modules.

Abstract: Materials having diverse coefficients of thermal expansion are joined together by means of an adhesive film, electrically insulative mesh structure that cures at room temperature. An adhesive film bonding technique is employed to mount a printed wiring board, having a relatively low coefficient of thermal expansion, to a thermally and electrically conductive aluminum stiffener having a relatively high coefficient of thermal expansion, while maintaining the printed wiring board electrically insulated from the aluminum stiffener. A non-adhesive plastic `release` film is initially attached to a flat support substrate. A layer of electrically insulative mesh (glass cloth) is taped onto the plastic release film. The glass cloth is then impregnated with an electrically insulative adhesive that cures at room temperature. The aluminum stiffener is then placed on the adhesive-impregnated cloth layer, which is then cut to fit, using the aluminum stiffener as a template.