Abstract: A method for forming a structure using an interim temper process is provided. A metal material is partially-aged to a stable temper that does not require cold storage. The partially-aging step is completed at a supplier facility prior to the metal material being received by the manufacturer. Once received by the manufacturer, the partially-aged metal material is heated to a first temperature to perform retrogression. A structure is formed from the partially-aged metal material after performing the retrogression. The structure is shaped and inspected. The structure is then heated to a second temperature in an age oven to reach its final aged state. The final aged state may be close to, meet, or exceed a T6 temper.

Abstract: A method, system, and apparatus for a part forming system. The part forming system comprises a field shaper having a cavity configured to receive a workpiece and a die. The field shaper has a number of dimensions based on being inserted into a main coil. The workpiece is bent to form a part with a desired shape when an electromagnetic field from the main coil is applied to the field shaper while the field shaper is located within the main coil.

Abstract: A method for forming a structure using an interim temper process is provided. A metal material is partially-aged to a stable temper that does not require cold storage. The partially-aging step is completed at a supplier facility prior to the metal material being received by the manufacturer. Once received by the manufacturer, the partially-aged metal material is heated to a first temperature to perform retrogression. A structure is formed from the partially-aged metal material after performing the retrogression. The structure is shaped and inspected. The structure is then heated to a second temperature in an age oven to reach its final aged state. The final aged state may be close to, meet, or exceed a T6 temper.

Abstract: A method, system, and apparatus for a part forming system. The part forming system comprises a field shaper having a cavity configured to receive a workpiece and a die. The field shaper has a number of dimensions based on being inserted into a main coil. The workpiece is bent to form a part with a desired shape when an electromagnetic field from the main coil is applied to the field shaper while the filed shaper is located within the main coil.

Abstract: An interpenetrating polymer network (IPN) adhesive comprises an acrylated polymer system curable by radiation, and a flexible epoxy system thermally curable after the acrylated polymer system is cured.

Abstract: An interpenetrating polymer network (IPN) adhesive comprises an acrylated polymer system curable by radiation, and a flexible epoxy system thermally curable after the acrylated polymer system is cured.

Abstract: A composition is provided that consists essentially of a first polymer system and a second polymer system. The first polymer system has a first modulus of about 180 ksi to about 335 ksi. The first polymer system consists essentially of a thermosetting acrylate. The second polymer system consists essentially of a thermosetting epoxy system and an epoxy curing agent. The thermosetting epoxy system comprises a first epoxy.

Abstract: An interpenetrating polymer network (IPN) adhesive comprises an acrylated polymer system curable by radiation, and a flexible epoxy system thermally curable after the acrylated polymer system is cured.

Abstract: An interpenetrating polymer network (IPN) adhesive comprises an acrylated polymer system curable by radiation, and a flexible epoxy system thermally curable after the acrylated polymer system is cured.

Abstract: A composition is provided that consists essentially of a first polymer system and a second polymer system. The first polymer system has a first modulus of about 180 ksi to about 335 ksi. The first polymer system consists essentially of a thermosetting acrylate. The second polymer system consists essentially of a thermosetting epoxy system and an epoxy curing agent. The thermosetting epoxy system comprises a first epoxy.

Abstract: An interpenetrating polymer network (IPN) adhesive comprises an acrylated polymer system curable by radiation, and a flexible epoxy system thermally curable after the acrylated polymer system is cured.

Abstract: Embodiments of the invention include a sensor such as a capacitive sensor with improved scratch resistance. The sensor has a substrate and a layer of sensing elements formed thereon that are formed from materials having a greater mechanical firmness than conventional aluminum or other soft metal materials. Sensor interconnects also are made of such materials. The increased mechanical firmness of the sensing elements and interconnects improves the scratch and mechanical resistance thereof by reducing scratches, mechanical stress and cracks by reducing the deformation and consequently the bridge and/or gap effects of the sensing element material. Such effects plague conventional electronic devices, integrated circuits and sensors. Alternatively, the inventive sensor includes, e.g., a dielectric region operably coupled to the sensing elements and interconnects, thus forming a capacitive sensor or other electronic devices.

Abstract: A process for fabricating a vertical MOSFET device for use in integrated circuits is disclosed. In the process, at least three layers of material are formed sequentially on a semiconductor substrate. The three layers are arranged such that the second layer is interposed between the first and third layers. The second layer is sacrificial, that is, the layer is completely removed during subsequent processing. The thickness of the second layer defines the physical gate length of the vertical MOSFET. In the process the first and third layers have etch rates that are significantly lower than the etch rate of the second layer in an etchant selected to remove the second layer. The top layer, which is either the third or subsequent layer, is a stop layer for a subsequently performed mechanical polishing step that is used to remove materials formed over the at least three layers. After the at least three layers of material are formed on the substrate, a window or trench is formed in the layers.

Abstract: An improved, scattering-type mask for use in a charged-particle beam lithography process comprises the mask having a membrane portion and a scattering portion, the membrane portion being fabricated with a conductive material or a plurality of materials in which one of them is conductive. The conductive nature of the membrane portion mitigates the accumulation of charge in the mask, thereby enhancing the definition of the charged-particle pattern transferred from the mask onto the wafer under fabrication and reducing the distortion obtained with the system.