Patents by Inventor Gary S. Willen

Gary S. Willen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6858280
    Abstract: A new insulation system is provided that contains microspheres. This insulation system can be used to provide insulated panels and clamshells, and to insulate annular spaces around objects used to transfer, store, or transport cryogens and other temperature-sensitive materials. This insulation system provides better performance with reduced maintenance than current insulation systems.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: February 22, 2005
    Assignee: Technology Applications, Inc.
    Inventors: Mark S. Allen, Gary S. Willen, Robert A. Mohling
  • Patent number: 6679315
    Abstract: A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover. The system also includes a thermally conductive evaporator. The evaporator is adapted to be attached to a heat source such as the microprocessor. The cover includes inlet and outlet ports and the base includes a capillary passage. A refrigerant or heat transferring fluid is pumped or past through the passage before making a sudden expansion in an expansion zone just before passing to an evaporator chamber. Pool and flow boiling and forced convection may occur in the evaporator chamber as heat is transferred from the microprocessor through the thermally conductive evaporator to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: January 20, 2004
    Assignee: Marconi Communications, Inc.
    Inventors: Michael R. Cosley, Richard L. Fischer, Jack H. Thiesen, Gary S. Willen
  • Publication number: 20030203149
    Abstract: A new insulation system is provided using microspheres. This insulation system can be used to provide insulated panels, clamshells, and insulate annular spaces around objects. This insulation system provides better performance than current insulation systems.
    Type: Application
    Filed: February 26, 2003
    Publication date: October 30, 2003
    Inventors: Mark S. Allen, Gary S. Willen, Robert A. Mohling
  • Patent number: 6595006
    Abstract: The present invention discloses a miniature thermodynamic device that can be constructed using standard micro-fabrication techniques. The device can be used to provide cooling, generate power, compress gases, pump fluids and reduce pressure below ambient (operate as a vacuum pump). Embodiments of the invention relating to the production of a cooling effect and the generation of electrical power, change the thermodynamic state of the system by extracting energy from a pressurized fluid. Energy extraction is attained using an expansion process, which is as nearly isentropic as possible for the appropriately chosen fluid. An isentropic expansion occurs when a compressed gas does work to expand, and in the disclosed embodiments, the gas does work by overcoming either an electrostatic or a magnetic force.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: July 22, 2003
    Assignee: Technology Applications, Inc.
    Inventors: Jack H. Thiesen, Gary S. Willen, Robert A. Mohling
  • Publication number: 20030131972
    Abstract: A microscale chip cooling system for a heat dissipating item, such as Intel's Pentium brand microprocessor, is disclosed. The system includes a 40 millimeter by 40 millimeter thermally insulated housing including a base and a cover and the system also includes a thermally conductive evaporator. The evaporator is adapted to be attached to a heat source such as the microprocessor. The cover includes inlet and outlet ports and the base includes a capillary passage. A refrigerant or heat transferring fluid is pumped or past through the passage before making a sudden expansion in an expansion zone just before passing to an evaporator chamber. Pool and flow boiling and forced convection may occur in the evaporator chamber as heat is transferred from the microprocessor through the thermally conductive evaporator to the refrigerant. The refrigerant then returns to a compressor to repeat the cycle. The system is extremely small and very efficient.
    Type: Application
    Filed: January 14, 2002
    Publication date: July 17, 2003
    Inventors: Michael R. Cosley, Richard L. Fischer, Jack H. Thiesen, Gary S. Willen
  • Publication number: 20030101732
    Abstract: The present invention discloses a miniature thermodynamic device that can be constructed using standard micro-fabrication techniques. The device can be used to provide cooling, generate power, compress gases, pump fluids and reduce pressure below ambient (operate as a vacuum pump). Embodiments of the invention relating to the production of a cooling effect and the generation of electrical power, change the thermodynamic state of the system by extracting energy from a pressurized fluid. Energy extraction is attained using an expansion process, which is as nearly isentropic as possible for the appropriately chosen fluid. An isentropic expansion occurs when a compressed gas does work to expand, and in the disclosed embodiments, the gas does work by overcoming either an electrostatic or a magnetic force.
    Type: Application
    Filed: February 12, 2002
    Publication date: June 5, 2003
    Applicant: Technology Applications, Inc.
    Inventors: Jack H. Thiesen, Gary S. Willen, Robert A. Mohling
  • Publication number: 20020148237
    Abstract: The present invention discloses a miniature thermodynamic device that can be constructed using standard micro-fabrication techniques. The device can be used to provide cooling, generate power, compress gases, pump fluids and reduce pressure below ambient (operate as a vacuum pump). Embodiments of the invention relating to the production of a cooling effect and the generation of electrical power, change the thermodynamic state of the system by extracting energy from a pressurized fluid. Energy extraction is attained using an expansion process, which is as nearly isentropic as possible for the appropriately chosen fluid. An isentropic expansion occurs when a compressed gas does work to expand, and in the disclosed embodiments, the gas does work by overcoming either an electrostatic or a magnetic force.
    Type: Application
    Filed: February 12, 2002
    Publication date: October 17, 2002
    Applicant: Technology Applications, Inc.
    Inventors: Jack H. Thiesen, Gary S. Willen, Robert A. Mohling