Patents by Inventor Gary Shipe

Gary Shipe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetically sealed package for a high power hybrid circuit
    Patent number: 5700724
    Abstract: A metal ring frame, having co-fired ceramic inserts, is hermetically sealed to a copper/molybdenum base using a brazing alloy having a melting temperature which is approximately the cross-over temperature for the TCE curves of the base and ring frame. Preferably the base contains at least 20% copper by weight. The brazing alloy is a silver/copper alloy such as 56% Ag, 22% Cu, 17% Zn and 5% Sn, or one with a higher brazing temperature such as 78/22 Ag/Cu, and is used for brazing both the inserts into the frame and the frame onto the base.
    Type: Grant
    Filed: August 2, 1994
    Date of Patent: December 23, 1997
    Assignee: Philips Electronic North America Corporation
    Inventor: Gary Shipe