Abstract: A chemical mechanical polishing pad window having a controlled texture surface comprising repeated patterned features. The window results in an improved endpoint detection and in situ rate monitoring by providing consistent values of the ISRMmax-min characteristic over the lifetime of a CMP pad. Also provided is a chemical mechanical polishing pad with the inventive window.

Abstract: A chemical mechanical polishing (CMP) pad with a release liner that has a pull tab is prepared by contacting the CMP pad to an adhesive layer with release liner. The adhesive layer sheet is cut along a first portion of a perimeter of the CMP pad. An extension of the adhesive layer is cut that extends beyond an edge of the CMP pad at the remaining portion of the perimeter of the CMP pad, thereby creating an extension of the adhesive layer sheet with the adhesive layer exposed. The exposed adhesive layer is cut to a depth not to extend into the release liner. The adhesive layer is removed from the exposed region leaving only the release liner pull tab as a continuous extension of the release liner material.

Abstract: A chemical mechanical polishing pad window having a controlled texture surface comprising repeated patterned features. The window results in an improved endpoint detection and in situ rate monitoring by providing consistent values of the ISRMmax-min characteristic over the lifetime of a CMP pad. Also provided is a chemical mechanical polishing pad with the inventive window.

Abstract: An improved microelectromechanical switch assembly comprises a linearly movable switch rod constrained via a switch bearing, the switch rod being actuated by electrostatic deflection. Movement of the switch rod to one end of its travel puts the switch assembly in a closed state while movement of the switch rod to the other end of its travel puts the switch assembly in an open state. In an embodiment of the invention, one or both of the switch rod and the switch bearing are fabricated of a carbon nanotube. The improved microelectromechanical switch assembly provides low insertion loss and long lifetime in an embodiment of the invention.

Abstract: A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.