Abstract: A quick-change material module of a stencil wiper assembly for wiping a stencil of a stencil printer includes a supply roller to receive a roll of material, a take-up roller to receive used material, and a drive to move the material across the stencil between the supply roller and the take-up roller. The supply roller is designed to move between an operating position in which the module functions to wipe the stencil and a changing position in which the supply roller is accessible to change the roll of material. A pivot mechanism is further disclosed for pivoting the supply roller between the operating and changing positions. A frame supports the supply roller, the take-up roller, and the drive. The pivot mechanism includes at least one pivot arm having one end rotatably attached to the supply roller and an opposite end pivotably attached to the frame.

Abstract: An apparatus for performing operations on a surface of an electronic substrate, the apparatus comprising a frame, a dispenser coupled to the frame to dispense material onto the electronic substrate, a stencil coupled to the frame having at least one aperture to receive the material to be deposited through the aperture onto the surface of the electronic substrate, a controller that controls dispensing of materials on substrates, and a cleaning system coupled to the frame and coupled to the controller for removing material from the stencil, wherein the cleaning system uses carbon dioxide particles for removing the residue from the stencil.

Abstract: A system and method for performing operations on a plurality of workpieces comprises an operations portion and a load/unload portion, a plurality of independently operable work heads located in the operations portion, the work heads each being operable to perform work on the plurality of workpieces, a transfer system, the transfer system including a plurality of mounting devices, the transfer system being operable to deliver the mounting devices into and out of the operations portion of the system, the plurality of workpieces being contained in workpiece-holding structures, the workpiece-holding structures being mountable on the plurality of mounting devices, wherein one of the plurality of mounting devices is positioned in the operations portion of the system and work is performed on the plurality of workpieces by at least one of the plurality of independently operable work heads while another one of the plurality of mounting devices is positioned in the load/unload portion of the system and workpiece-holdin

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, the solder dispensing unit includes a squeegee arm with a solder gathering head. During operation using the squeegee arm with the solder gathering head, two circuit boards are fed to the working area, and both of the circuit boards are serially processed, with excess solder being removed from the board after the processing of each of the boards.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system to maintain the temperature of the viscous material contained in the chamber.

Abstract: Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system to maintain the temperature of the viscous material contained in the chamber.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, a solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. In one embodiment, a solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and an orifice defining structure. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines a cavity for containing molten solder. The orifice defining structure includes a flat disk having an orifice defined therethrough for producing a stream of molten solder and a disk support structure that supports the disk around the orifice and is replaceably coupled to the cavity-defining structure. Also disclosed is an apparatus that deposits a selected pattern of solder onto a substrate and includes a substrate support, a solder ejector that directs solder droplets to desired positions on the support, and an ejector aligner that adjusts the orientation of the solder ejector in two angular dimensions to enable adjustment of the trajectory of the stream of molten solder droplets.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

Abstract: A dual track stencil system includes a plurality of pairs of adjustable conveyor rails, including a first pair of conveyor rails and a second pair of conveyor rails. The first and second pairs of conveyor rails of the dual track system are advantageously adjustable to accommodate variable width circuit boards or operation of the system in single track mode. The first and second pairs of conveyor rails can be independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area at which the circuit boards are stenciled and includes a stencil having two patterns formed thereon. In one embodiment, the stencil system includes a solder dispensing system for dispensing solder paste onto the stencil.

Abstract: A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device having a number of perforations arranged to form the pattern, a support apparatus that supports the substrate in a printing position, and a material dispenser having a substantially cylindrical chamber to contain the viscous material. The chamber has an opening through which the material is dispensed. The material dispenser is positioned over the device and constructed and arranged to dispense the viscous material through the perforations in the device onto the substrate. In embodiments of the present invention, the material dispenser is adapted to receive standard cartridges containing the viscous material, and the printer further includes a pressurized air source for forcing the viscous material from the cartridges into the material dispenser and from the material dispenser through the perforations on the device and onto the substrate.

Abstract: An apparatus for dispensing solder paste for application through a stencil or a screen to a circuit board includes a housing having an elongated chamber along a longitudinal axis and a rotatable member within the chamber. The housing has an inlet connected to a supply of solder paste and an elongated opening at the bottom of the chamber for delivering solder paste from the chamber. The rotatable member creates a pressure gradient within the chamber and causes delivery of the solder paste through the opening at controlled pressure. The rotatable member is spaced from an inner surface of the housing defining the chamber. The axis of rotation of the rotatable member is movable in two directions and the speed of rotation is adjustable. The forces on the rotating member are monitored in order to monitor solder conditions.

Abstract: An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and a gas-delivery system associated with the solder ejector. The substrate support has structure for bearing a substrate on which one or more electronic components are to be mounted. The solder ejector has a housing that defines an orifice for producing a stream of molten solder droplets along a selected trajectory relative to the substrate support to deposit molten solder onto the substrate in a selected pattern. The gas delivery system has an input for receiving pressurized inert gas and an output aligned with the directed stream of molten droplets for discharging from the orifice of the solder ejector a flow of inert gas aligned with the ejected molten solder droplets. A method for depositing a selected pattern of solder onto a substrate is also described.