Patents by Inventor Gary T. Galli

Gary T. Galli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly of opto-electronic module with improved heat sink
    Patent number: 6822875
    Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: November 23, 2004
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Paul Francis Fortier, Ladd William Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman, Real Tetreault
  • Assembly of opto-electronic module with improved heat sink
    Publication number: 20030059176
    Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
    Type: Application
    Filed: October 24, 2002
    Publication date: March 27, 2003
    Applicant: International Business Machines Corporation
    Inventors: Benson Chan, Paul Francis Fortier, Ladd William Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman, Real Tetreault
  • Assembly of opto-electronic module with improved heat sink
    Patent number: 6508595
    Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
    Type: Grant
    Filed: May 11, 2000
    Date of Patent: January 21, 2003
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Paul Francis Fortier, Ladd William Freitag, Gary T. Galli, Francois Guindon, Glen Walden Johnson, Martial Letourneau, John H. Sherman, Real Tetreault