Abstract: A material recovery system for an optical component includes a reservoir containing gas and configured to supply a gas flow containing the gas. The material recovery system also includes an ion beam generator disposed on the reservoir and configured to receive the gas flow and to ionize the gas in the gas flow to generate an ion beam. The ion beam is configured to be directed to the optical component to remove at least a portion of a F-containing optical material degraded by exposure to VUV radiation, DUV radiation, and/or photo-contamination.

Abstract: A photocathode emitter can include a transparent substrate, a photocathode layer, and a plasmonic structure array disposed between the transparent substrate and the photocathode layer. The plasmonic structure can serve as a spot-confining structure and an electrical underlayer for biasing the photocathode. The plasmonic structure can confine the incident light at subwavelength sizes.

Abstract: A method for ion-assisted deposition of optical coatings. The method may include performing one or more pre-deposition processes. The method may include performing evaporation using an evaporation assembly of an ion-assisted deposition system during ion-assisted deposition using a low energy ion beam source of the ion-assisted deposition system. The method may further include performing sputtering using a sputtering assembly of an ion-assisted deposition system. The evaporation assembly may include an evaporating target and an evaporator configured to directly evaporate target material from the evaporating target onto a surface of the one or more samples. The sputtering assembly may include a sputtering target and a sputtering high energy ion source configured to sputter target material from the sputtering target onto a surface of the one or more samples. The method may include performing one or more post-deposition treatment processes.

Abstract: An optical system includes a bulk material including a fluorine (F)-containing optical material. The bulk material is exposed to an environment at a pressure ranging from atmospheric to vacuum when the bulk material is under extreme ultra-violet (EUV), vacuum ultra-violet (VUV), deep ultra-violet (DUV) and/or UV radiation. The environment includes at least one type of gas or vapor. The at least one type of gas or vapor includes polar molecules.

Abstract: An optical component includes an optical material which is a fluorine (F)-containing optical material doped with an F-containing species different from the F-containing optical material. A coating system for depositing the optical material onto a substrate or a bulk material of an optical component is an electron beam evaporation coating system, an ion assisted deposition coating system, or an ion beam sputtering coating system.

Abstract: A material recovery system for an optical component includes a reservoir containing gas and configured to supply a gas flow containing the gas. The material recovery system also includes an ion beam generator disposed on the reservoir and configured to receive the gas flow and to ionize the gas in the gas flow to generate an ion beam. The ion beam is configured to be directed to the optical component to remove at least a portion of a F-containing optical material degraded by exposure to VUV radiation, DUV radiation, and/or photo-contamination.

Abstract: A photocathode emitter includes a transparent substrate, a photocathode layer, and a plasmonic structure array disposed between the transparent substrate and the photocathode layer. The plasmonic structure array is configured to operate at a wavelength from 193 nm to 430 nm. The plasmonic structure array can be made of aluminum. An electron beam can be generated from a light beam directed at the plasmonic structure array of the photocathode emitter.

Abstract: A photocathode emitter includes a transparent substrate, a photocathode layer, and a plasmonic structure array disposed between the transparent substrate and the photocathode layer. The plasmonic structure array is configured to operate at a wavelength from 193 nm to 430 nm. The plasmonic structure array can be made of aluminum. An electron beam can be generated from a light beam directed at the plasmonic structure array of the photocathode emitter.

Abstract: A high-brightness electron beam source is disclosed. The electron beam source may include a broadband illumination source configured to generate broadband illumination. A tunable spectral filter may be configured to filter the broadband illumination to provide filtered illumination having an excitation spectrum. The electron beam source may further include a photocathode configured to emit one or more electron beams in response to the filtered illumination, wherein emission from the photocathode is adjustable based on the excitation spectrum of the filtered illumination from the tunable spectral filter.

Abstract: The system includes a photocathode electron source, diffractive optical element, and a microlens array to focus the beamlets. A source directs a radiation beam to the diffractive optical element, which produces a beamlet array to be used in combination with a photocathode surface to generate an array of electron beams from the beamlets.

Abstract: A photocathode emitter can include a transparent substrate, a photocathode layer, and a plasmonic structure array disposed between the transparent substrate and the photocathode layer. The plasmonic structure can serve as a spot-confining structure and an electrical underlayer for biasing the photocathode. The plasmonic structure can confine the incident light at subwavelength sizes.

Abstract: The system includes a photocathode electron source, diffractive optical element, and a microlens array to focus the beamlets. A source directs a radiation beam to the diffractive optical element, which produces a beamlet array to be used in combination with a photocathode surface to generate an array of electron beams from the beamlets.

Abstract: A photocathode structure, which can include one or more of Cs2Te, CsKTe, CsI, CsBr, GaAs, GaN, InSb, CsKSb, or a metal, has a protective film on an exterior surface. The protective film includes one or more of ruthenium, nickel, platinum, chromium, copper, gold, silver, aluminum, or an alloy thereof. The protective film can have a thickness from 1 nm to 10 nm. The photocathode structure can be used in an electron beam tool like a scanning electron microscope.

Abstract: An emitter with a diameter of 100 nm or less is used with a protective cap layer and a diffusion barrier between the emitter and the protective cap layer. The protective cap layer is disposed on the exterior surface of the emitter. The protective cap layer includes molybdenum or iridium. The emitter can generate an electron beam. The emitter can be pulsed.

Abstract: A photocathode structure, which can include one or more of Cs2Te, CsKTe, CsI, CsBr, GaAs, GaN, InSb, CsKSb, or a metal, has a protective film on an exterior surface. The protective film includes one or more of ruthenium, nickel, platinum, chromium, copper, gold, silver, aluminum, or an alloy thereof. The protective film can have a thickness from 1 nm to 10 nm. The photocathode structure can be used in an electron beam tool like a scanning electron microscope.

Abstract: An emitter with a diameter of 100 nm or less is used with a protective cap layer and a diffusion barrier between the emitter and the protective cap layer. The protective cap layer is disposed on the exterior surface of the emitter. The protective cap layer includes molybdenum or iridium. The emitter can generate an electron beam. The emitter can be pulsed.