Abstract: Physical vapor deposition (PVD) system comprises a chamber, an upper shield and a lower shield mounted within the chamber, a cover ring having one or more tabs extending radially inwardly therefrom. The PAD system further includes a shutter disk having one or more notched areas formed in the periphery thereof to receive non-contacting the one or more tabs of the cover ring. The cover ring has two or more recesses formed in an upper side thereof with a guide pin extending from the center of the recesses. The lower shield has two or more cups with a hole therein to be engaged with the guide pin of the cover ring to keep the lower shield from rotating with respect to the cover ring. The cups of the lower shield are inserted into the recesses of the cover ring. These improvements enable a standard shutter arm assembly and a shutter disk to be utilized in a two-tab block-out scheme.

Abstract: Physical vapor deposition (PVD) system comprises a chamber, an upper shield and a lower shield mounted within the chamber, a cover ring having one or more tabs extending radially inwardly therefrom. The PVD system further includes a shutter disk having one or more notched areas formed in the periphery thereof to receive non-contactingly the one or more tabs of the cover ring. The cover ring has two or more recesses formed in an upper side thereof with a guide pin extending from the center of the recesses. The lower shield has two or more cups with a hole therein to be engaged with the guide pin of the cover ring to keep the lower shield from rotating with respect to the cover ring. The cups of the lower shield are inserted into the recesses of the cover ring. These improvements enable a standard shutter arm assembly and a shutter disk to be utilized in a two-tab block-out scheme.

Abstract: Physical vapor deposition (PVD) system comprises a chamber, an upper shield and a lower shield mounted within the chamber, a cover ring having one or more tabs extending radially inwardly therefrom. The PVD system further includes a shutter disk having one or more notched areas formed in the periphery thereof to receive non-contactingly the one or more tabs of the cover ring. The cover ring has two or more recesses formed in an upper side thereof with a guide pin extending from the center of the recesses. The lower shield has two or more cups with a hole therein to be engaged with the guide pin of the cover ring to keep the lower shield from rotating with respect to the cover ring. The cups of the lower shield are inserted into the recesses of the cover ring. These improvements enable a standard shutter arm assembly and a shutter disk to be utilized in a two-tab block-out scheme.

Abstract: Physical vapor deposition (PVD) system comprises a chamber, an upper shield and a lower shield mounted within the chamber, a cover ring having one or more tabs extending radially inwardly therefrom. The PVD system further includes a shutter disk having one or more notched areas formed in the periphery thereof to receive non-contactingly the one or more tabs of the cover ring. The cover ring has two or more recesses formed in an upper side thereof with a guide pin extending from the center of the recesses. The lower shield has two or more cups with a hole therein to be engaged with the guide pin of the cover ring to keep the lower shield from rotating with respect to the cover ring. The cups of the lower shield are inserted into the recesses of the cover ring. These improvements enable a standard shutter arm assembly and a shutter disk to be utilized in a two-tab block-out scheme.

Abstract: During development of photoresist on the frontside of a semiconductor wafer, developer solution is prevented from contaminating the backside of a wafer by using a film of de-ionized water to seal the backside. The wafer is mounted to a vacuum chuck, which is in contact with the backside of the wafer. A ring member having a top surface is positioned adjacent to the backside of the wafer mounted to the vacuum-chuck. The film of de-ionized water is formed between the backside of the wafer and the ring so that the film of deionized water provides a seal to prevent developer solution from being drawn by vacuum pressure to the area on the backside of the wafer which is adjacent to the vacuum chuck. To aid in formation of the water sealing ring, the top surface of the ring if formed of a non-wetting material and a circular groove is formed in the top surface. A housing from which the ring projects provides a shield for developer solution.