Abstract: Poly(arylene ether)-poly(alkylene ether) block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a poly(alkylene ether), and an activated aromatic carbonate.

Abstract: Poly(arylene ether)-polyester block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a hydroxy-terminated polyester, and an activated aromatic carbonate.

Abstract: Poly(arylene ether)-polycarbonate block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a hydroquinone, a poly(arylene ether), and an activated aromatic carbonate.

Abstract: Poly(arylene ether)-polysiloxane block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a hydroxyaryl-terminated polysiloxane, and an activated aromatic carbonate.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: A curable composition is formulated from an epoxy resin; a flame-retardant additive essentially free of phenolic groups and of epoxy groups; and a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferable is triazine. The preferred thermoplastic resin is a poly(phenylene ether). The inventive curable compositions advantageously can be combined with reinforcement in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.

Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.

Abstract: A method comprising (a) synthesis of a poly(arylene ether) having the structure (1) wherein m is an integer having an average value in the range from about 3 to about 300; (b) solution functionalization of polymer (1) to form functionalized poly(arylene ether) having the structure (2) wherein X is a reactive functional group selected from the group consisting of anhydride, hydroxyl, epoxy, carboxyl, —R1OH, R1CO2R2, —R1CH2═CH2, or vinyl, wherein R1 is a primary or secondary divalent alkyl or haloalky group having from 1 to 20 carbons, or an aryl group and R2 is a primary or secondary alkyl group having from 1 to 10 carbons; and Q4 is hydrogen, X, or a mixture thereof; (c) reaction of functionalized poly(arylene ether) (2) with a poly(organosiloxane) having structure (3): wherein x is zero or one and Y is a functional group reactive with X, selected from the group consisting of —OH, —CH2═CH2, epoxy, amino, carboxy, &mdash

Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.

Abstract: Bisphenols containing free-radical generating groups, such as bissilylpinacolate groups, are provided. These bisphenols can be used to make free-radical generating polycarbonate macroinitiators having thermally labile groups which can be heated with vinyl monomers, such as styrene to make polycarbonate block copolymers.

Abstract: Bisphenols containing free-radical generating groups, such as bissilylpinacolate groups, are provided. These bisphenols can be used to make free-radical generating polycarbonate macroinitiators having thermally labile groups which can be heated with vinyl monomers, such as styrene to make polycarbonate block copolymers.

Abstract: Bisphenols containing free-radical generating groups, such as bissilylpinacolate groups, are provided. These bisphenols can be used to make free-radical generating polycarbonate macroinitiators having thermally labile groups which can be heated with vinyl monomers, such as styrene to make polycarbonate block copolymers.

Abstract: A method for making hydroxy-terminated arylene ethers is provided by condensing an aromatic diol, such as hydroquinone with 4-fluoroacetophenone followed by a Baeyer-Villiger oxidation, and hydrolysis of the resulting diester.