Abstract: A transducer includes one or more actuator components configured to be encompassed by a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement with respect to the frame and configured to create haptic feedback in the in-plane or out-of-plane movement to the frame. The transducer also includes one or more sensing layers configured to detect changes of displacement in the frame, wherein the sensing layer is connected to the one or more actuator components.

Abstract: A portable electronic communication device including a display, a pressure sensor array including a plurality of pressure sensors, and an electronic processor communicatively coupled to the pressure sensor array. The electronic processor is configured to receive, from the pressure sensor array, a plurality of stress tensor measurements corresponding to a user interaction with the display, perform an interpolation of the plurality of pressure measurements, and determine, based on the interpolation, a faulty sensor of the plurality of sensors.

Abstract: A device to electrochemically sequence DNA that includes a redox species includes at least one edge electrode, at least one stack of insulator material, and a pair of DNA translocation electrodes including a DNA translocation working electrode and a DNA translocation counter electrode, where the thickness of the at least one edge electrode is about 0.5 nanometers, and the thickness of the at least one stack of insulator material is about 10 nanometers. Methods of electrochemically sequencing a strand of DNA are also provided.

Abstract: A portable electronic communication device including a display, a pressure sensor array including a plurality of pressure sensors, and an electronic processor communicatively coupled to the pressure sensor array. The electronic processor is configured to receive, from the pressure sensor array, a plurality of stress tensor measurements corresponding to a user interaction with the display, perform an interpolation of the plurality of pressure measurements, and determine, based on the interpolation, a faulty sensor of the plurality of sensors.

Abstract: A transducer includes one or more actuator components configured to be encompassed by a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement with respect to the frame and configured to create haptic feedback in the in-plane or out-of-plane movement to the frame. The transducer also includes one or more sensing layers configured to detect changes of displacement in the frame, wherein the sensing layer is connected to the one or more actuator components.

Abstract: A system of determining a location of a force exerted on a mobile communication device, the system comprising a first pressure sensor disposed within the mobile communication device and adjacent an outer surface of the mobile communication device, wherein the first pressure sensor is attached to the outer surface via a first interface material, wherein the first pressure sensor is configured to detect pressure below the outer surface, a second pressure sensor disposed within the mobile communication device and adjacent the outer surface of the mobile communication device, wherein the second pressure sensor is attached to the outer surface via a second interface material, wherein the second pressure sensor is configured to detect pressure below the outer surface, and a processor coupled to the first and second pressure sensors and configured to activate an associated mobile communication device command in response to the detected pressure being above a threshold.

Abstract: A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

Abstract: A method of fabricating a MEMS device includes an epi-polysilicon cap layer epitaxially growth on one of a substrate or a sacrificial layer deposited on the substrate. A portion of the epi-polysilicon cap layer has been removed to form a plurality of access openings. The sacrificial layer is etched away to form a cavity below the access openings. A barrier layer is deposited over the epi-polysilicon cap layer, inner walls of the cavity, and inner walls of the access openings using an atomic layer deposition (ALD) process. A refill epi-polysilicon layer is epitaxially grown in the access openings and seals the openings after the cavity is formed.

Abstract: A method of fabricating a MEMS device includes performing an atomic layer deposition (ALD) process to deposit a barrier layer such as Aluminum Oxide (AI2O3) having a thickness on a sacrificial layer deposited on a substrate. A portion of the barrier layer is removed to form an etched structure defined as a trench. An epi-polysilicon cap layer is epitaxially growth on the barrier layer and the entire etched structure. A portion of the epi-polysilicon cap layer has been removed to form a plurality of openings. The sacrificial layer is etched away leaving a cavity below the etched openings. A refill epi-polysilicon layer is epitaxially grown in the openings and seals the entire openings after a gap is formed between the cap layer and the substrate.

Abstract: A MEMS device, e.g., a flexible MEMS pressure sensor, is formed by disposing a sacrificial layer, such as photoresist, on a substrate. A first flexible support layer is disposed on the substrate, and a first conductive layer is disposed over a portion of the first support layer. A liquid or gel separator, e.g., silicone oil, is disposed on an internal region of the first conductive layer. A second flexible support layer encapsulates the first conductive layer and the separator. A second conductive layer disposed over the second support layer at least partially overlaps the first conductive layer and forms a parallel plate capacitor. A third flexible support layer encapsulates the second conductive layer and second support layer. Soaking the sensor in hot water releases the sensor from the sacrificial layer.

Abstract: A system for selectively carbonizing a polymer coating on a substrate includes a laser, a memory, and a controller. The memory stores data associated with at least one characteristic of a substrate having a coating that includes a polymer material. The controller is operatively connected to the laser, and is configured to control the laser based on the data such that, in an open-air environment, an interaction between the laser and the polymer material carbonizes a portion of the coating, but does not sustain combustion of the polymer material. A method of producing an article with a selectively carbonized coating includes controlling a laser system such that interaction between a laser and a polymer material forming a coating on a substrate carbonizes a portion of the coating, but does not sustain a combustion of the polymer material in an open-air environment.

Abstract: A device for generating thermal images includes a low resolution infrared (IR) sensor supported within a housing and having a field of view. The IR sensor is configured to generate thermal images of objects within the field of view having a first resolution. A spatial information sensor supported within the housing is configured to determine a position for each of the thermal images generated by the IR sensor. A processing unit supported within the housing is configured to receive the thermal images and to combine the thermal images based on the determined positions of the thermal images to produce a combined thermal image having a second resolution that is greater than the first resolution.

Abstract: A device to electrochemically sequence DNA that includes a redox species includes at least one edge electrode, at least one stack of insulator material, and a pair of DNA translocation electrodes including a DNA translocation working electrode and a DNA translocation counter electrode, where the thickness of the at least one edge electrode is about 0.5 nanometers, and the thickness of the at least one stack of insulator material is about 10 nanometers. Methods of electrochemically sequencing a strand of DNA are also provided.

Abstract: A system for selectively carbonizing a polymer coating on a substrate includes a laser, a memory, and a controller. The memory stores data associated with at least one characteristic of a substrate having a coating that includes a polymer material. The controller is operatively connected to the laser, and is configured to control the laser based on the data such that, in an open-air environment, an interaction between the laser and the polymer material carbonizes a portion of the coating, but does not sustain combustion of the polymer material. A method of producing an article with a selectively carbonized coating includes controlling a laser system such that interaction between a laser and a polymer material forming a coating on a substrate carbonizes a portion of the coating, but does not sustain a combustion of the polymer material in an open-air environment.

Abstract: A method of fabricating a MEMS device includes an epi-polysilicon cap layer epitaxially growth on one of a substrate or a sacrificial layer deposited on the substrate. A portion of the epi-polysilicon cap layer has been removed to form a plurality of access openings. The sacrificial layer is etched away to form a cavity below the access openings. A barrier layer is deposited over the epi-polysilicon cap layer, inner walls of the cavity, and inner walls of the access openings using an atomic layer deposition (ALD) process. A refill epi-polysilicon layer is epitaxially grown in the access openings and seals the openings after the cavity is formed.

Abstract: A trenched base capacitive humidity sensor includes a plurality of trenches formed in a conductive layer, such as polysilicon or metal, on a substrate. The trenches are arranged parallel to the each other and partition the conductive layer into a plurality of trenched silicon electrodes. At least two trenched silicon electrodes are configured to form a capacitive humidity sensor. The trenches that define the trenched silicon electrodes can be filled partially (e.g., sidewall coverage) or completely with polyimide (Pl) or silicon nitride (SiN). A polyimide layer may also be provided on the conductive layer over the trenches and trenched electrodes. The trenches and the trenched silicon electrodes may have different widths to enable different sensor characteristics in the same structure.

Abstract: A device with an out-of-plane electrode includes a device layer positioned above a handle layer, a first electrode defined within the device layer, a cap layer having a first cap layer portion spaced apart from an upper surface of the device layer by a gap, and having an etch stop perimeter defining portion defining a lateral edge of the gap, and an out-of-plane electrode defined within the first cap layer portion by a spacer.

Abstract: A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.

Abstract: A method of fabricating a MEMS device includes performing an atomic layer deposition (ALD) process to deposit a barrier layer such as Aluminum Oxide (AI2O3) having a thickness on a sacrificial layer deposited on a substrate. A portion of the barrier layer is removed to form an etched structure defined as a trench. An epi-polysilicon cap layer is epitaxially growth on the barrier layer and the entire etched structure. A portion of the epi-polysilicon cap layer has been removed to form a plurality of openings. The sacrificial layer is etched away leaving a cavity below the etched openings. A refill epi-polysilicon layer is epitaxially grown in the openings and seals the entire openings after a gap is formed between the cap layer and the substrate.

Abstract: A microelectromechanical systems (MEMS) structure includes a substrate, an epitaxial polysilicon cap located above the substrate, a first cavity portion defined between the substrate and the epitaxial polysilicon cap, and a first graphene component having at least one graphene surface immediately adjacent to the first cavity portion.