Abstract: A method of preparing a capped poly(arylene ether) resin includes reacting a capping agent with a blend of two or more poly(arylene ether) resins having different intrinsic viscosities. Cured compositions prepared from these capped poly(arylene ether) resins exhibit improved balances of stiffness, toughness, and dielectric properties compared to compositions with two or more separately capped and isolated poly(arylene ether) resins.

Abstract: A solvent-resistant polymeric membrane comprising a solvent-inert polymer having a solubility parameter greater than 18 (J/cm3)0.5, such as a polyketone, a polyether ketone, polyarylene ether ketone ketone, a polyimide, a polyetherimide, or a polyphenylene sulfide, is described. The solvent-resistant polymeric membrane can be prepared by methods in which solvent-inert polymers form a solution at room temperature.

Abstract: A solvent-resistant polymeric membrane comprising a solvent-inert polymer having a solubility parameter greater than 18 (J/cm3)0.5, such as a polyketone, a polyether ketone, polyarylene ether ketone ketone, a polyimide, a polyetherimide, or a polyphenylene sulfide, is described. The solvent-resistant polymeric membrane can be prepared by methods in which solvent-inert polymers form a solution at room temperature.

Abstract: Membranes as well as a methods of treating membranes are disclosed. The method of treating a membrane includes contacting the membrane with a first solvent, contacting the membrane with an inert solvent, and contacting the membrane with an amine reactive compound. The first solvent includes a solvent having a Hansen solubility parameter in a range from about 10.0 to about 18. The membrane includes a polymer having an amine group.

Abstract: The separation of hydrocarbon mixtures comprising a polymerizable vinyl containing polyester of the formula I: Each R and R2 is independently a C6-C20 aromatic residue or a C1-C20 aliphatic residue. Each R1 is independently hydrogen or C1-C5 alkyl; “j” is an integer in the range of 1-1000. Z is a heteroatom or two hydrogen atoms. The invention is also directed to the method of preparing the separation membrane.

Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Abstract: A solvent-resistant composite membrane composition comprising polymer coated uniformly on porous filtration membranes can be used in a membrane separation process. The polymer compositions may further comprise comonomers, crosslinking monomers, catalysts, thickening agents, or other additives.

Abstract: A solvent-resistant polyimide membrane comprising a cross-linked polyimide homopolymer or copolymer is described. The homopolymer or the copolymer is functionalized with a nucleophilic modifier, and the membrane has suitable permeability and is resistant to solvents. In addition, a process of preparing polyimide membrane free of macrovoids is also described.

Abstract: A solvent-resistant composite membrane composition comprising polymer coated uniformly on porous filtration membranes can be used in a membrane separation process. The polymer compositions may further comprise comonomers, crossing monomers, catalysts, thickening agents, or other additives.

Abstract: An interfacial composite structure as well as a method of making an interfacial composite structure are disclosed. The interfacial composite structure includes a support structure; and an interfacial membrane. The interfacial membrane is formed by a first organic solution and a second organic solution. The first organic solution includes a first reactant and the second organic solution includes a second reactant. The support structure is in contact with at least one of the organic solutions and the interfacial membrane includes a crosslinked polymer formed by the first reactant and the second reactant.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Abstract: An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Abstract: A tack-free composition comprising a functionalized polymer having a having a glass transition temperature greater than about 24° C., a reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C., a reinforcing filler, and an initiator (curing agent) is provided. The tack-free composition is useful as a molding composition for encapsulation of electronic devices and electronic device components.

Abstract: A cross-linked polyimide is disclosed. The cross-linked polyimide includes a polyimide and at least one oxygenated hydrocarbon. The oxygenated hydrocarbon cross-links the polyimide. A porous cross-linked membrane is also disclosed. The porous cross-linked membrane includes a support structure and a cross-linked polyimide disposed on the support structure. The cross-linked polyimide includes a polyimide; and at least one oxygenated hydrocarbon cross-linking the polyimide. Also disclosed are methods of making the cross-linked polyimide and the porous cross-linked membrane.

Abstract: A curable composition containing a functionalized poly(arylene ether), an acryloyl monomer, and a filler is compression molded by a method that includes introducing the composition to a mold, closing the mold and applying a first temperature of about 120 to about 200° C. and a first pressure of about 1,000 to about 40,000 kilopascals for about 1 to about 100 seconds; opening the mold for about 0.005 to about 10 seconds; and closing the mold a second time and applying a second temperature of about 120 to about 200° C. and a second pressure of about 1,000 to about 40,000 kilopascals for about 20 to about 100 seconds. Molded articles formed by the method exhibit improved dielectric properties.

Abstract: A functionalized poly(arylene ether) having a pendant carbon-carbon double bond is prepared by reacting the hydroxy end group of a poly(arylene ether) with a polyisocyanate compound to produce a urethane-capped poly(arylene ether) having pendant isocyanate functionality, which is then reacted with a polyfunctional compound having a carbon-carbon double bond and a hydroxy, thiol, or amino group. The functionalized poly(arylene ether) is useful as a component of a curable composition in which its carbon-carbon double bond copolymerizes with one or more olefinically unsaturated comonomers.

Abstract: A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.

Abstract: A curable composition includes a poly(arylene ether) and a fused alicyclic (meth)acrylate monomer. Also described are a method of preparing the composition, a cured composition derived from the curable composition, and an article comprising the cured composition. The composition is useful, for example, as a bulk molding compound.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.