Abstract: The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.

Abstract: The invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials. The compositions of the invention comprise: i. a polyimide base polymer in an amount of at least 60 weight percent; ii. a discontinuous phase of inorganic material present in an amount of at least 4 weight percent; iii. a non-ionic halogenated dispersing agent in an amount of at least 0.1 weight percent; and iv. up to 30 weight percent of other optional ingredients, such as, fillers, processing aids, colorants, or the like. The compositions of the invention generally exhibit excellent high frequency performance and can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means.

Abstract: An electrical resistor material comprising a dielectric polymeric binder, (optionally) electrically conductive particles, and an electrically conductive polymer, where the electrically conductive particles (if any) are used to make a positive temperature coefficient of resistance (TCR) component, and where the electrically conductive polymer is (optionally) doped, and is used to make negative temperature coefficient of resistance (TCR) component. The positive and negative components are combined at such a ratio, in the presence of a dielectric polymer binder, sufficient to provide a resistor with a sheet resistance between 0.01 and 10,000,000 ohms per square, and where the resistor has a final temperature coefficient of resistance (TCR) between −500 ppm/° C. and 500 ppm/° C.