Patents by Inventor Gaurang Kunal Shah

Gaurang Kunal Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aqueous primer composition for enhanced film formation and method of using the same
    Patent number: 9803089
    Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: October 31, 2017
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Yiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah
  • AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME
    Publication number: 20170044381
    Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
    Type: Application
    Filed: November 1, 2016
    Publication date: February 16, 2017
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Yiqiang ZHAO, Dalip K. KOHLI, Gaurang Kunal SHAH
  • Aqueous primer composition for enhanced film formation and method of using the same
    Patent number: 9512336
    Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: December 6, 2016
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Yiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah
  • AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME
    Publication number: 20150096680
    Abstract: A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
    Type: Application
    Filed: August 15, 2014
    Publication date: April 9, 2015
    Applicant: Cytec Industries Inc.
    Inventors: Yiqiang Zhao, Dalip K. Kohli, Gaurang Kunal Shah