Patents by Inventor Gavin Appel

Gavin Appel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and article of manufacture for wire bonding with staggered differential wire bond pairs
    Patent number: 8084857
    Abstract: A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: December 27, 2011
    Assignee: Agere Systems
    Inventors: Gavin Appel, Ashley Rebelo, Christopher J. Wittensoldner
  • METHOD AND ARTICLE OF MANUFACTURE FOR WIRE BONDING WITH STAGGERED DIFFERENTIAL WIRE BOND PAIRS
    Publication number: 20100120198
    Abstract: A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.
    Type: Application
    Filed: January 22, 2010
    Publication date: May 13, 2010
    Inventors: Gavin Appel, Ashley Rebelo, Christopher J. Wittensoldner
  • Integrated circuit with staggered differential wire bond pairs
    Patent number: 7675168
    Abstract: An integrated circuit comprises an integrated circuit package and one or more circuit elements disposed within the integrated circuit package. The integrated circuit also comprises at least two differential wire bond pairs providing connections for at least one of the one or more circuit elements. Proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: March 9, 2010
    Assignee: Agere Systems Inc.
    Inventors: Gavin Appel, Ashley Rebelo, Christopher J. Wittensoldner
  • Integrated circuit with staggered differential wire bond pairs
    Publication number: 20060192300
    Abstract: An integrated circuit comprises an integrated circuit package and one or more circuit elements disposed within the integrated circuit package. The integrated circuit also comprises at least two differential wire bond pairs providing connections for at least one of the one or more circuit elements. Proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.
    Type: Application
    Filed: February 25, 2005
    Publication date: August 31, 2006
    Inventors: Gavin Appel, Ashley Rebelo, Christopher Wittensoldner