Abstract: A system includes a robotic device and a processing circuit programmed to enable planning of a placement of an implant relative to a bone based on bone densities of a plurality of regions of the bone, generate a control object based on the placement of the implant, and control the robotic device using the control object.

Abstract: A surgical system includes a robotic device, a surgical tool mounted on the robotic device, and a processing circuit. The processing circuit is configured to receive image data of an anatomy, generate a virtual bone model based on the image data, identify a soft tissue attachment point on the virtual bone model, plan placement of an implant based on the soft tissue attachment point, generate a control object based on the placement of the implant, and control the robotic device to confine the surgical tool within the control object.

Abstract: A surgical system includes a robotic device, a surgical tool mounted on the robotic device, and a processing circuit. The processing circuit is configured to receive image data of an anatomy, generate a virtual bone model based on the image data, identify a soft tissue attachment point on the virtual bone model, plan placement of an implant based on the soft tissue attachment point, generate a control object based on the placement of the implant, and control the robotic device to confine the surgical tool within the control object.

Abstract: A corner pad includes a backer having a first side and a second side. The first side is configured to receive an adhesive. The corner pad also includes a plurality of wands extending from the second side. Each of the plurality of wands includes a first end and a second end and each of the plurality of wands is integral with the backer at the second end forming an interface. Each interface is substantially parallel to one another.

Abstract: A window latch for a double hung window includes a housing and a tongue slidably engaged with the housing for moving between a retracted position and an extended position. A pivotable latch pivotably mounted within the housing releasably retains the tongue in the retracted position. As a window sash of the double hung window is lifted, a trigger slidably engaged with the housing pivots the pivotable latch so as to release the tongue from the retracted position.

Abstract: A diplexer includes a diplexer housing having transmit and receive waveguide channels formed therein. A cover is received on the diplexer housing over the transmit and receive waveguide channels. A septum is inserted between the diplexer housing and cover and configured to provide isolation between any transmitter and receiver signals and a desired frequency band of operation.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards.

Abstract: A millimeter wave pulsed radar system includes a radar synthesizer having a voltage controlled oscillator/phase locked loop (VCO/PLL) circuit, direct digital synthesizer (DDS) circuit and quadrature modulator circuit that are operative to generate an intermediate frequency local oscillator signal (IF/LO signal). A radar transceiver is operative with the radar synthesizer for receiving the IF/LO signal. A transmitter section has a frequency multiplier that multiplies the IF/LO signal up to a millimeter wave (MMW) radar signal and a receiver section and includes a direct conversion mixer that receives a MMW radar signal and the IF/LO signal to produce I/Q baseband signals that are later digitized and processed.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A subminiature coaxial connector (SMA) includes a shell, dielectric and conductor element that includes a biasing element that engages an interface contact tip and biases the interface contact tip into electrical contact against an electrical circuit, such as a trace on the circuit board without soldering, and adjusts for relative movements created by thermal mismatch.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A subminiature coaxial connector (SMA) includes a shell, dielectric and conductor element that includes a biasing element that engages an interface contact tip and biases the interface contact tip into electrical contact against an electrical circuit, such as a trace on the circuit board without soldering, and adjusts for relative movements created by thermal mismatch.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.