Abstract: A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

Abstract: A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

Abstract: An encapsulated assemblage and a process for making an encapsulated assemblage comprising:(a) silanizing a substrate thereby forming a silanized substrate;(b) coating said silanized substrate with at least one thin extruded coherent film forming a coated substrate, said film consisting essentially of:(1) about 75 to about 90 parts by weight of a blend of:(a) about 65 to about 75 parts by weight of a selectively hydrogenated two-block polymer wherein one polymer block is designated by A and a second polmer block is designated by B such that prior to hydrogenation,(1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight in the range of from about 5,000 to about 75,000, said A blocks comprising from about 10 to about 40% by weight of the total block copolymer, and(2) each B is a polymer block having a number average molecular weight in the range of from about 10,000 to 150,000 and is formed by polymerizing a conjugated diene having from 4 to 10 carbon a

Abstract: An encapsulated assemblage and a process for making comprising:(a) silanizing a substrate;(b) coating the silanized substrate with at least one thin extruded coherent film consisting essentially of:(1) about 75-90 parts by weight of:(a) about 65 to about 75 parts of a selectively hydrogenated two-block polymer (A-B) such that prior to hydrogenation,(1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight of 5000 to 75,000 and comprising from about 10 to about 40% by weight of the total block copolymer, and(2) each B is a polymer block having a number average molecular weight of 10,000 to 150,000 and comprising from about 90 to about 60% weight of the total block copolymer, and(b) about 25 to about 35 parts by weight of a selectively hydrogenated multiblock copolymer (A-B) such that:(1) each A is a polymer endblock of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight of 5,000 to 75,000, said A blocks comprising from a

Abstract: A solar cell assemblage and method of making, comprising:(a) a pre-treated silanized transparent substrate;(b) a layer of semiconductor material;(c) an electrical contact on the surface of said layer of semiconductor material;(d) an extruded transparent film encapsulating the assemblage which comprises 75 to 91 parts by weight of a blend of:65 to 75 parts by weight of a selectively hydrogenated two-block polymer wherein(1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene and the A blocks are from 10 to 40% by weight of the total block copolymer, and(2) each B is a polymer block formed by polymerizing a conjugated diene, and the B blocks are 90 to 60% weight of the total block copolymer, and25 to 35 parts by weight of a selectively hydrogenated multiblock copolymer wherein:(1) each A is a polymer endblock of a monovinyl or alpha alkyl monovinyl arene and the A blocks are 10 to 40% by weight of the total block copolymer, and(2) each B is a polymer midblock is formed by polymerizing a conj