Patents by Inventor Gayatri E. Perlin

Gayatri E. Perlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for realizing ultra-thin sensors and electronics with enhanced fragility
    Patent number: 10020219
    Abstract: A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: July 10, 2018
    Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Eugene H. Cook, Amy Duwel, David J. Carter, Gayatri E. Perlin
  • Method for realizing ultra-thin sensors and electronics with enhanced fragility
    Patent number: 10014204
    Abstract: A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: July 3, 2018
    Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.
    Inventors: Eugene H. Cook, Amy Duwel, David J. Carter, Gayatri E. Perlin
  • METHOD FOR REALIZING ULTRA-THIN SENSORS AND ELECTRONICS WITH ENHANCED FRAGILITY
    Publication number: 20180033670
    Abstract: A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
    Type: Application
    Filed: October 6, 2017
    Publication date: February 1, 2018
    Inventors: Eugene H. Cook, Amy Duwel, David J. Carter, Gayatri E. Perlin
  • METHOD FOR REALIZING ULTRA-THIN SENSORS AND ELECTRONICS WITH ENHANCED FRAGILILTY
    Publication number: 20180012786
    Abstract: A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one tether connecting each semiconductor dielet of the array of semiconductor dielets to the frame.
    Type: Application
    Filed: July 11, 2016
    Publication date: January 11, 2018
    Inventors: Eugene H. Cook, Amy Duwel, David J. Carter, Gayatri E. Perlin