Patents by Inventor Gayatri NATU
Gayatri NATU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250027195Abstract: A method includes performing an atomic layer deposition (ALD) process with respect to a plurality of target elements to coat interiors of the plurality of target elements with a protective coating. Performing the ALD process includes alternating delivery of a first precursor inside the plurality of target elements for a first duration to form an adsorption layer on the interiors of the plurality of target elements, alternating purging of the first precursor from the plurality of target elements for a second duration, and alternating delivery of a second precursor inside the plurality of target elements for a third duration to cause the second precursor to react with the adsorption layer and form a target layer on the interiors of the plurality of target elements.Type: ApplicationFiled: July 18, 2023Publication date: January 23, 2025Inventors: Yogesh Tomar, Nikshep Patil, Kirubanandan Shanmugam Naina, Hanish Kumar Panavalappil Kumarankutty, Gayatri Natu, Mahesh Chelvaraj Arcot, Senthil Kumar Nattamai Subramanian, Hari Venkatesh Rajendran, Michael Rice, Christopher Laurent Beaudry
-
Publication number: 20240284650Abstract: A coated chamber component comprises a chamber component and a coating deposited on a surface of the chamber component, the coating comprising an electrically-dissipative material. The electrically-dissipative material is to provide a dissipative path from the coating to a ground. The coating is uniform, conformal, and has a thickness ranging from about 10 nm to about 900 nm.Type: ApplicationFiled: April 26, 2024Publication date: August 22, 2024Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Patent number: 12004337Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.Type: GrantFiled: November 10, 2022Date of Patent: June 4, 2024Assignee: Applied Materials, Inc.Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Publication number: 20240117491Abstract: Embodiments of an apparatus for coating a plurality of gas lines are provided herein. In some embodiments, an apparatus for coating a plurality of gas lines via an ALD process includes: an oven having an enclosure that defines an interior volume configured to house the plurality of gas lines, the enclosure having a door configured for transferring the plurality of gas lines into and out of the interior volume; a plurality of inlet ports disposed through a first wall of the enclosure; a plurality of exhaust ports disposed through a second wall of the enclosure; a fluid panel disposed outside of the oven and coupled to the plurality of inlet ports via corresponding ones of a plurality of fluid distribution assemblies; and a foreline disposed outside of the oven and coupled to the plurality of exhaust ports.Type: ApplicationFiled: October 7, 2022Publication date: April 11, 2024Inventors: Hanish Kumar PANAVALAPPIL KUMARANKUTTY, Yogesh TOMAR, Nikshep M. PATIL, Hari Venkatesh RAJENDRAN, Kirubanandan Naina SHANMUGAM, Gayatri NATU, Mahesh ARCOT, Senthil Kumar NATTAMAI SUBRAMANIAN, Steven D. MARCUS, Michael R. RICE
-
Patent number: 11702744Abstract: Methods of forming a metal oxyfluoride films are provided. A substrate is placed in an atomic layer deposition (ALD) chamber having a processing region. Flows of zirconium-containing gas, a zirconium precursor gas, for example, Tris(dimethylamino)cyclopentadienyl zirconium, an oxygen-containing gas, a fluorine containing gas, and an yttrium precursor, for example, tris(butylcyclopentadienyl)yttrium gas are delivered to the processing region, where a metal oxyfluoride film such as an yttrium zirconium oxyfluoride film, is formed.Type: GrantFiled: February 16, 2022Date of Patent: July 18, 2023Assignee: Applied Materials, Inc.Inventors: Nitin Deepak, Gayatri Natu, Albert Barrett Hicks, III, Prerna Sonthalia Goradia, Jennifer Y. Sun
-
Publication number: 20230077895Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.Type: ApplicationFiled: November 10, 2022Publication date: March 16, 2023Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Patent number: 11547030Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.Type: GrantFiled: June 2, 2020Date of Patent: January 3, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Patent number: 11540432Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.Type: GrantFiled: June 2, 2020Date of Patent: December 27, 2022Assignee: Applied Materials, Inc.Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Publication number: 20220351960Abstract: Methods and precursors for depositing metal fluoride films on a substrate surface are described. The method includes exposing the substrate surface to a metal precursor and a fluoride precursor. The fluoride precursor is volatile at a temperature in a range of from 20° C. to 200° C. The metal precursor reacts with the fluoride precursor to form a non-volatile metal fluoride film.Type: ApplicationFiled: June 15, 2021Publication date: November 3, 2022Applicant: Applied Materials, Inc.Inventors: Lisa J. Enman, Mark Saly, Sanni Seppaelae, Gayatri Natu
-
Publication number: 20220259735Abstract: Methods of forming a metal oxyfluoride films are provided. A substrate is placed in an atomic layer deposition (ALD) chamber having a processing region. Flows of zirconium-containing gas, a zirconium precursor gas, for example, Tris(dimethylamino)cyclopentadienyl zirconium, an oxygen-containing gas, a fluorine containing gas, and an yttrium precursor, for example, tris(butylcyclopentadienyl)yttrium gas are delivered to the processing region, where a metal oxyfluoride film such as an yttrium zirconium oxyfluoride film, is formed.Type: ApplicationFiled: February 16, 2022Publication date: August 18, 2022Applicant: Applied Materials, Inc.Inventors: Nitin Deepak, Gayatri Natu, Albert Barrett Hicks, III, Prerna Sonthalia Goradia, Jennifer Y. Sun
-
Patent number: 11390947Abstract: A method of forming a fluorinated metal film is provided. The method includes positioning an object in an atomic layer deposition (ALD) chamber having a processing region, depositing a metal-oxide containing layer on an object using an atomic layer deposition (ALD) process, depositing a metal-fluorine layer on the metal-oxide containing layer using an activated fluorination process, and repeating the depositing the metal-oxide containing layer and the depositing the metal-oxide containing layer until a fluorinated metal film with a predetermined film thickness is formed. The activated fluorination process includes introducing a first flow of a fluorine precursor (FP) to the processing region. The FP includes at least one organofluorine reagent or at least one fluorinated gas.Type: GrantFiled: February 25, 2020Date of Patent: July 19, 2022Assignee: Applied Materials, Inc.Inventors: Nitin Deepak, Suresh Chand Seth, Prerna Sonthalia Goradia, Geetika Bajaj, Darshan Thakare, Jennifer Y. Sun, Gayatri Natu
-
Publication number: 20220037126Abstract: Embodiments of the disclosure relate to articles, coated chamber components and methods of coating chamber components with a protective coating that includes at least one metal fluoride having a formula selected from the group consisting of M1xFw, M1xM2yFw and M1xM2yM3zFw, where at least one of M1, M2, or M3 is magnesium or lanthanum. The protective coating can be deposited by atomic layer deposition, chemical vapor deposition, electron beam ion assisted deposition, or physical vapor deposition.Type: ApplicationFiled: August 3, 2020Publication date: February 3, 2022Inventors: Jennifer Y. Sun, Ren-Guan Duan, Gayatri Natu, Tae Won Kim, Jiyong Huang, Nitin Deepak, Paul Brillhart, Lin Zhang, Yikai Chen, Sanni Sinikka Seppälä, Ganesh Balasubramanian, JuanCarlos Rocha, Shankar Venkataraman, Katherine Elizabeth Woo
-
Publication number: 20210100141Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.Type: ApplicationFiled: June 2, 2020Publication date: April 1, 2021Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Publication number: 20210100087Abstract: Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.Type: ApplicationFiled: June 2, 2020Publication date: April 1, 2021Inventors: Gayatri Natu, Geetika Bajaj, Prerna Goradia, Darshan Thakare, David Fenwick, XiaoMing He, Sanni Seppaelae, Jennifer Sun, Rajkumar Thanu, Jeff Hudgens, Karuppasamy Muthukamatchy, Arun Dhayalan
-
Publication number: 20200283897Abstract: Embodiments described herein provide a method of forming amorphous a fluorinated metal film. The method includes positioning an object in an atomic layer deposition (ALD) chamber having a processing region, depositing a metal-oxide containing layer on an object using an atomic layer deposition (ALD) process, depositing a metal-fluorine layer on the metal-oxide containing layer using an activated fluorination process, and repeating the depositing the metal-oxide containing layer and the depositing the metal-oxide containing layer until a fluorinated metal film with a predetermined film thickness is formed. The activated fluorination process includes introducing a first flow of a fluorine precursor (FP) to the processing region. The FP includes at least one organofluorine reagent or at least one fluorinated gas.Type: ApplicationFiled: February 25, 2020Publication date: September 10, 2020Inventors: Nitin DEEPAK, Suresh Chand SETH, Prerna Sonthalia GORADIA, Geetika BAJAJ, Darshan THAKARE, Jennifer Y. SUN, Gayatri NATU