Abstract: A current sink model is provided by determining the charge consumed by each type of a predetermined group of standard cell types under each of a plurality of conditions, determining the quantity of such standard cells of each type in the region of interest on the chip, and then using the charge consumption and quantity of standard cells of each type to create a waveform representing current over time.

Abstract: Systems and methods for testing the reliability of a semiconductor component are disclosed herein. One embodiment of a method for testing reliability, among others, comprises providing simulation code of a standard cell, wherein the standard cell represents the semiconductor component. The method includes extracting foliage points of a node of the standard cell and running a reliability test on each foliage point. Then, the standard cell can be characterized by the worst performing foliage point. A foliage point, for example, may be defined as a portion of a node that can be connected to a wire or route leading to external circuitry.