Patents by Inventor GE-CHENG LIU

GE-CHENG LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150279961
    Abstract: Compared with the typical Si and GaAs material, a wide bandgap material (III-N compound) has the better electronic properties, particularly the operation stability and the temperature sensitivity, and is extremely suitable for the high power electronic application. The invention proposes a high power vertical GaN device for providing the reverse breakdown voltage higher than or equal to 600 V, the lower on-resistance is lower than or equal to 5 m?-cm2 and the forward current as high as 3 A/mm2.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 1, 2015
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: CHIH-FANG HUANG, TING-FU CHANG, GE-CHENG LIU, YU-TENG TSENG, SHAO-YEN CHIU