Patents by Inventor Ge Gong

Ge Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093194
    Abstract: The present invention belongs to the technical field of biomedicine, and mainly relates to a miR-7-5p mimic for inhibiting migration and invasion of breast cancer, a screening method and an application thereof. The sequence of the miR-7-5p is shown in SEQ ID NO.1. The present invention has found that the miR-7-5p mimic generates a significant inhibitory effect on breast cancer through targeted inhibition of the molecular mechanism of RYK. In vitro culture system, the miR-7-5p mimic can function to inhibit migration and invasion capabilities of breast cancer. The miR-7-5p mimic can inhibit RYK protein and mRNA levels in breast cancer. In nude mice, the miR-7-5p mimic can also significantly inhibit migration and invasion capabilities of breast cancer. Therefore, the present invention demonstrates that the miR-7-5p mimic can be a small-nucleic-acid drug to significantly inhibit breast cancer metastasis.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Applicant: QUFU NORMAL UNIVERSITY
    Inventors: Ge Yang, Zhaoyi Liang, Chengchuan Che, Jinfeng Liu, Zhijin Gong
  • Patent number: 6646343
    Abstract: A method and an integrated circuit package support a high-speed integrated circuit operating at 10 GHz or higher switching speeds. The packaged integrated circuit has external terminals, a semiconductor die having conventional bonding pads, a substrate (e.g., printed circuit board) having conductive traces to couple input, output or bi-directional signals between bonding finger areas of the conductive traces and the external terminals. A ground plate that is electrically isolated from a conductive trace is positioned in the vicinity of the bonding finger area of the conductive trace. Bond wires connect the bonding pads of the electronic circuit and the bonding finger areas of the conductive traces. The ground plate improves integrity in a high-speed signal by canceling the complex impedance of a bond wire.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: November 11, 2003
    Assignee: BitBlitz Communications, Inc.
    Inventors: Nirmal Sharma, Ge Gong, Jason Chen