Abstract: A method and a device are provided for playing a multimedia file. The device sends a first audio data packet to an audio player device and sends a first video data packet to a video player device. The first audio data packet and the first video data packet both include a data test identifier. The device receives a first timestamp from the audio player device. The device receives a second timestamp from the video player device. The device then sends a second audio data packet and a second video data packet respectively to the audio player device and the video player device according to the first timestamp and the second timestamp. Thus, the audio player device and the video player device play synchronously the second audio data packet and the second video data packet.

Abstract: A method and a device are provided for playing a multimedia file. The device sends a first audio data packet to an audio player device and sends a first video data packet to a video player device. The first audio data packet and the first video data packet both include a data test identifier. The device receives a first timestamp from the audio player device. The device receives a second timestamp from the video player device. The device then sends a second audio data packet and a second video data packet respectively to the audio player device and the video player device according to the first timestamp and the second timestamp. Thus, the audio player device and the video player device play synchronously the second audio data packet and the second video data packet.

Abstract: A semiconductor wafer is transported by a mechanical system into or out of a quartz housing filled with a protection gas. The wafer is placed between and spaced apart from two graphite plates. A RF induction coil surrounding the quartz housing is used to heat the graphite plates. Radiation from the heated graphite plates heats the wafer from room temperature to an elevated desired temperature. During the time period when a wafer absorbs radiation primarily through electron-to-electron transition, heat convection and conduction by the protection gas conveys heat from the graphite plates to the wafer to accelerate the heating of the wafer and reduces temperature nonuniformity of the wafer.