Abstract: A method for controlling the image display includes an image capturing process, an image recognition process, a feature determination process, an image updating process, and an image outputting process. The image capturing process is to capture an input image. The image recognition process is to recognize a specified feature in the input image and generate a recognized image. The feature determination process is to determine whether a target feature exists in the recognized image and when the target feature exists in the recognized image, it also determines whether there is an indication pattern recorded in the image control system and generates a first command or a second command accordingly. The image updating process is to generate an indicator pattern according to the first command and superimpose the indicator pattern on the input image to generate an output image. The image outputting process is to output the output image.

Abstract: An Fan-out packaging system, comprising dedicated frame with associated movable metallic spring feature(s) for incoming known-good-die (KGD), is invented. The movable spring anchor(s) along with the boundaries of the frame locks the KGD in its designated position during EMC implementation and subsequent processes. In this system/approach, the position accuracy of KGDs during the wafer reconstitution process will be mostly dominated by the dicing accuracy. The proposed system is a very low cost approach as it does not need the expensive software/tool set and does not have a low throughput site-to-site lithography correction during exposure after metrology is carried out for every flash field. This system is particularly useful for chiplet consisting of component chips from different technologies and from substrate made of different material.

Abstract: A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position. A streamline design is also invented to provide better productivity. The invented pick and place tool or chip bonder is particularly useful for applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces.

Abstract: An Fan-out packaging system, comprising dedicated frame with associated movable metallic spring feature(s) for incoming known-good-die (KGD), is invented. The movable spring anchor(s) along with the boundaries of the frame locks the KGD in its designated position during EMC implementation and subsequent processes. In this system/approach, the position accuracy of KGDs during the wafer reconstitution process will be mostly dominated by the dicing accuracy. The proposed system is a very low cost approach as it does not need the expensive software/tool set and does not have a low throughput site-to-site lithography correction during exposure after metrology is carried out for every flash field. This system is particularly useful for chiplet consisting of component chips from different technologies and from substrate made of different material.

Abstract: A air purification system, whose air flow pipeline made of highly reflective and low absorptive material for UVC or UVB light acts also as a UV light waveguide, with a UVC and/or UVB LED built inside the pipeline, is invented. The system is based on the design concept of maximizing UV light exposure dosage to deactivate all the bioaerosols in the air flow pass through the system. The proposed system can be easily integrated into travel pillow, backbag, handbag, belt bag as well as air supply systems for public and private transport systems. The system provides purified air supply for travelers in the closed environment such as in a airplane, or on a train against various dangerous viruses including COVID-19 and SARS virus. It can also be used in office during flu season as well as provide cleaned air supply to its users against the hay-fever.

Abstract: A system and a method for image blurring processing are provided. The method includes: obtaining an image and a depth information corresponding to the image; identifying an object and a background in the image according to the depth information, wherein the object includes a plurality of object pixels and the background includes a plurality of background pixels; defining a number of an edge pixel spaced between the object and the background; performing a blurring processing on the edge pixel and the background pixels respectively by using a plurality of masks with different sizes; combining the plurality of object pixels, the edge pixel after the blurring processing, and the background pixels after the blurring processing to generate an output image; and outputting the output image.

Abstract: A portable or handhold air cleaning system, whose air flow pipeline made of highly reflective and low absorptive material for UVC or UVB light acts also as a UV light waveguide, is invented. The system features a TEC cooled LED light source; air flow warm up mechanism; and UV light absorption/air cleaning enhancement device. The system is useful for travellers and office workers during flu and hay-fever seasons.

Abstract: A CMOS compatible material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index material(s) fabricated first on a unpatterned SOI wafer, a bonded system substrate, a set of photonic circuitry made within a SOI layer of the SOI wafer after its substrate and BOX layer removed, and some coupling devices enabling light travelling between the devices made within these two layers. A solution to provide IIIV laser diodes boned and embedded in the system substrate is also proposed. The invention provides a great material platform to offer full set of photonic building blocks for all sort of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field size.

Abstract: A portable or handhold air purification system, whose air flow pipeline made of highly reflective and low absorptive material for UVC or UVB light acts also as a UV light waveguide, is invented. The system is based on the design concept of maximizing UV light exposure dosage to deactivate all the pollutants in the air flow going through to allow the system to use UVC and/or UVB LED. The system also has some features around the middle point of the air flow path to either further increase light exposure, or clean the air flow through the interaction between the specially designed nano particles and incoming UV light. Moreover, an ozone filter and an air heating devices, with energy either from the heat sink of LED's TEC or a device based on plasmonic resonance induced photothermal effects, are placed near the air outlet of the system for further enhancement. The system is very useful for travelers in the closed environment such as in a airplane, or on a train.

Abstract: A clothes and accessories fitting method, a display system and a computer-readable recording medium thereof are provided, where the method is applicable to a display system having an image capturing device and a screen and includes the following steps. Images of a user wearing a first apparel appearing in front of the screen are continuously or intermittently captured by using the image capturing device. When a first image of the user in a particular pose is determined to be included in the images, the first image is shot by using the image capturing device. A foreground region and a background region in the first image are segmented, and the background region is processed to generate a processed background region. A first preview image is generated according to the foreground region and the processed background region and displayed on the screen.

Abstract: A CMOS compatible heterogeneously integrated material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index (contrast) material(s), a bonded single crystal Si layer transfer from either a SOI wafer or a ion implanted single crystal Si wafer ready for ion cut split on top of the bottom layer, and some devices enabling light coupling between the devices made within these two layers. The invention provides a great material platform to offer a full set of photonic building blocks for all sorts of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field.

Abstract: A CMOS compatible heterogeneously integrated material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index (contrast) material(s), a bonded single crystal Si layer transfer from either a SOI wafer or a ion implanted single crystal Si wafer ready for ion cut split on top of the bottom layer, and some devices enabling light coupling between the devices made within these two layers. The invention provides a great material platform to offer a full set of photonic building blocks for all sorts of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field.

Abstract: A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position. A streamline design is also invented to provide better productivity. The invented pick and place tool or chip bonder is particularly useful for applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces.

Abstract: A piece of chip-to-wafer and chip-to-chip bonding equipment, which has innovative designs enabling chip(s) from either a diamagnetic carrier or a diced wafer to expose the chip back side surface for pickup, is invented. The designs either use a levitation technology, or air dynamic, or a novel mechanical design to fulfill the chip front surfaces touchless requirement to avoid the chip surface contamination. The invented chip bonder is particularly useful for bonding applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces or bonding surfaces.

Abstract: An acoustic wave device system with its piezoelectric layer originating from a single crystal piezoelectric wafer/substrate is invented along with sets of detailed process steps to fabricate such a device using wafer-to-wafer and/or die-to-wafer bonding technologies. The proposed device system is particularly good to make bulk acoustic wave (BAW) devices. Methods allowing the single crystal piezoelectric wafer/substrate to be re-used are also given. The proposed methods include detailed process steps to allow heterogeneous integration of electrical chips into the system in a very cost efficient manner. The invention provides a practical and low-cost approach to fabricate the radio frequency (RF) front end chip incorporating RF filters and electronic components integrated into a small footprint which is particularly useful for mobile device and RF stations.

Abstract: A method for fabricating a photonic integrated circuit (PIC) comprises providing a silicon-on-insulator (SOI) wafer comprising an insulator layer disposed between a base semiconductor layer and a SOI layer, wherein the SOI layer comprises a waveguide, providing at least one slot within the SOI layer, wherein the at least one slot is positioned on the same or opposite sides of the waveguide, and wherein the at least one slot is positioned at a predetermined distance away from the waveguide, and removing a portion of the insulator layer to form an etched-out portion of the insulator layer, wherein the etched-out portion is positioned directly beneath the waveguide, and wherein a width of the etched-out portion is at least the width of the waveguide.

Abstract: A system and a method for image blurring processing are provided. The method includes: obtaining an image and a depth information corresponding to the image; identifying an object and a background in the image according to the depth information, wherein the object includes a plurality of object pixels and the background includes a plurality of background pixels; defining a number of an edge pixel spaced between the object and the background; performing a blurring processing on the edge pixel and the background pixels respectively by using a plurality of masks with different sizes; combining the plurality of object pixels, the edge pixel after the blurring processing, and the background pixels after the blurring processing to generate an output image; and outputting the output image.

Abstract: A clothes and accessories fitting method, a display system and a computer-readable recording medium thereof are provided, where the method is applicable to a display system having an image capturing device and a screen and includes the following steps. Images of a user wearing a first apparel appearing in front of the screen are continuously or intermittently captured by using the image capturing device. When a first image of the user in a particular pose is determined to be included in the images, the first image is shot by using the image capturing device. A foreground region and a background region in the first image are segmented, and the background region is processed to generate a processed background region. A first preview image is generated according to the foreground region and the processed background region and displayed on the screen.

Abstract: A method for fabricating a photonic integrated circuit (PIC) comprises providing a silicon-on-insulator (SOI) wafer comprising an insulator layer disposed between a base semiconductor layer and a SOI layer, wherein the SOI layer comprises a waveguide, providing at least one slot within the SOI layer, wherein the at least one slot is positioned on the same or opposite sides of the waveguide, and wherein the at least one slot is positioned at a predetermined distance away from the waveguide, and removing a portion of the insulator layer to form an etched-out portion of the insulator layer, wherein the etched-out portion is positioned directly beneath the waveguide, and wherein a width of the etched-out portion is at least the width of the waveguide

Abstract: A heat assisted magnetic recording (HAMR) writer is described. The HAMR writer is coupled with a laser that provides energy having a first polarization state. The HAMR writer has an air-bearing surface (ABS) configured to reside in proximity to a media during use, a plurality of waveguides, a main pole and at least one coil. The main pole writes to the media and is energized by the coil(s). The waveguides receive the energy from the laser and direct the energy toward the ABS. The waveguides include an input waveguide and an output waveguide. The input waveguide is configured to carry light having the first polarization state. The output waveguide is configured to carry light having a second polarization state different from the first polarization state. The waveguides are optically coupled and configured to transfer the energy from the first polarization state to the second polarization state.