Abstract: A surface mountable coaxial solder interconnect. The invention provides a small, low-cost, passively self-aligning, high-frequency electronic interconnect adapted to mass production and method. The invention includes a substrate, a signal conductor, and an annular conductor. The substrate incorporates an annular pad and a signal pad substantially centered within the annular pad. The signal conductor includes reflowed solder and is wetted to the signal pad. Similarly, the annular conductor includes reflowed solder and is wetted to the annular pad. The invention may also provide a second substrate substantially parallel to the first substrate that includes a second annular pad and a second signal pad substantially centered within the second annular pad. In such a case, the signal conductor is also wetted to the second signal pad, and, similarly, the annular conductor is also wetted to the second annular pad. The method of the invention includes obtaining a mask and a substrate.

Abstract: The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.

Abstract: A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.

Abstract: A mask support device including two communicating elements, a first element having ferromagnetic shunts, and a second element containing permanent magnets, and wherein the elements are rotatable about a central axis and assume fixed positions in the rotation. The mask support device in one position attracts a ferromagnetic metal mask. In a second position, owing to the shunt redirecting the magnetic field, releases the metal mask.