Abstract: The invention relates to a method for the production of high purity silicon, characterized by the following steps: a) reaction of metallic silicon with silicon tetrachloride (SiCl4), hydrogen (H2) and hydrochloric acid (HCl) at a temperature of 500 to 800° C. and a pressure of 25 to 40 bar to give a trichlorosilane-containing (SiHCl3) feed gas stream, b) removal of impurities from the resultant trichlorosilane-containing feed gas stream by scrubbing with condensed chlorosilanes at a pressure of 25 to 40 bar and a temperature of 160 to 200° C.

Abstract: The invention relates to a method for the production of high purity silicon, characterized by the following steps: a) reaction of metallic silicon with silicon tetrachloride (SiCl4), hydrogen (H2) and hydrochloric acid (HCl) at a temperature of 500 to 800° C. and a pressure of 25 to 40 bar to give a trichlorosilane-containing (SiHCl3) feed gas stream, b) removal of impurities from the resultant trichlorosilane-containing feed gas stream by scrubbing with condensed chlorosilanes at a pressure of 25 to 40 bar and a temperature of 160 to 200° C.

Abstract: The invention relates to coating mixtures, containing in the anhydrous state at least one polysiloxane, at least one reactive inorganic filler, at least one inorganic material which is film-forming as melt and at least one reactive (oligo)silane, a process for manufacture and their use.

Abstract: Novel mixtures containing in the anhydrous state at least one polysiloxane, at least one reactive extender, at least one unreactive pigment and/or an unreactive extender, at least one lamellar or fibrous solid, at least one reactive (oligo)silane, optionally together with further additives, to a production process and to the use thereof.

Abstract: The process for producing alkylhalogenosilanes, which comprises reacting a physical mixture of silicon, a selenium or tellurium promoter and a copper catalyst with an alkyl halide.

Abstract: A thermoplastic moulding composition containing at least one sinterable ceramic or metal powder and a mixture of thermoplastic binders, wherein one of the binders is a silicone resin and the second binder is an organic resin. The silicone resin has the a softening point of 40.degree. to 150.degree. C. and an average formula of:R.sub.a.sup.1 Si (OH).sub.b (OR.sup.2).sub.c O.sub.(4-a-b-c)/2whereina is in the range of 0.95 to 1.2c is in the range of 0 to 0.2the sum of a+b+c is 1.05 to 1.5the sum b+c is at most 0.3R.sup.1 denotes methyl andR.sup.2 denotes one or more of C.sub.1 -C.sub.18 alkyl radicals.

Abstract: A metallurgical silicon is disclosed which contains substantially from 30 to 180 ppm of phosphorus comprised of a crystalline phase of primary silicon having a dissolved phosphorus content between 30 and 150 parts per million and intermetal phases whose global ratio is between 0.5 and 2%, wherein among the intermediary phases, the phase Si.sub.2 Al.sub.2 Ca does not exceed 0.3% of the total of the metallurgical silicon mass. The metallurgical silcon is used for the synthesis of alkyl or aryl halogenosilanes useful for the preparation of silicones.

Abstract: The present invention relates to novel polysiloxane-polyether-based copolymers which contain T units and comprise randomly linked organopolysiloxane units and linear polyether units, to a method for their preparation and their use.

Abstract: In the production of an organochlorosilane by reaction of silicon with at least one of an alkyl or aryl chloride in the presence of a copper catalyst, the improvement which comprises employing as the silicon fine-particle silicon containing surface-bound chlorine produced by contacting fine-particle silicon in reactive form with gaseous or liquid chlorine.

Abstract: Novel mixtures containing at least one polysiloxane and at least one reactive filler, at least one pigment and/or unreactive filler and optionally other additives, their preparation and use in coating. Preferably they are largely free of organic polymers.

Abstract: Metallic silicon for the Rochow-Synthesis is reduced to particles measuring at least 5 mm in their smallest dimension and 15 mm in their largest dimension, cooling the silicon from a temperature of at least 700.degree. C. to at most 120.degree. C. within a maximum of 2 seconds, and then ground and reacted.

Abstract: The invention relates to powder-form polymer mixtures of silicone resins (B) and thermoplastic polymers (A), to their production and to their use for the modification of thermoplatics.

Abstract: A process for the preparation of alkyl halogenosilanes comprising reacting silicon with alkyl halide in the presence of a copper catalyst and promoter substances and phosphorous and phosphorous compounds in combination with indium or indium compounds or aluminum or aluminum compounds or a mixture of aluminum or aluminum compounds and indium or indium compounds.

Abstract: In the production of organochlorosilanes by reaction of silicon with an alkyl- and/or arylchloride in the presence of a copper catalyst and, optionally, promoter elements, the improvement wherein the silicon has been atomized with an inert gas, has a particle size of less than about 1000 .mu.m, by weight has an Al content of about 0.05 to 0.38%, a Ca content of about 0.02 to 0.2% and an Fe content of about 0.25 to 0.55%.

Abstract: In the production of an organochlorosilane by reaction of silicon or a silicon alloy with an alkyl or aryl chloride in the presence of a copper catalyst, the improvement which comprises employing the silicon or alloy in atomized form.

Abstract: In a two-layer enamelling process in which the ground coat and surface coat powders are electrostatically applied to metallic substrates and subsequently baked together, the improvement which comprises employing a ground coat powder having an electrical resistivity of about 10.sup.10 to 10.sup.14 ohm. cm and a surface coat powder having an electrical resistivity of about 10.sup.14 to 10.sup.16 ohm. cm. Advantageously the surface tension of the ground coat amounts to at least about 0.280 N/m and the surface tension of the surface coat to at most about 0.260 N/m, the difference between the surface tensions of the ground coat and surface amounts to at least about 0.050 N/m, the ground coat powder has an electrical resistivity 10.sup.12 to 10.sup.14 ohm. cm and at least about 10.sup.2 ohm.