Abstract: Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state.

Abstract: An assembly comprises an exposure chamber configured to receive a structure and identify at least one portion of the structure for further processing. The exposure chamber is further configured to expose the at least one portion of the structure to radiation such that a high cure state and a low residual stress are achieved for the structure. A dosage level of the radiation is determined based, at least in part, on the composition of the structure.

Abstract: Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: An assembly comprises an exposure chamber configured to receive a structure and identify at least one portion of the structure for further processing. The exposure chamber is further configured to expose the at least one portion of the structure to radiation such that a high cure state and a low residual stress are achieved for the structure. A dosage level of the radiation is determined based, at least in part, on the composition of the structure.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.