Abstract: A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”).

Abstract: A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”).

Abstract: The present invention is a storage element for controlling a logic circuit and a logic device having a plurality of storage elements. The storage element has a first and a second non-volatile memory cells connected in series at an output node. Each of the first and second non-volatile memory cells is for storing a state opposite to the other. A demultiplexer has an input, a switched input and two outputs. The output node is connected to the input of the demultiplexer. One of the outputs is used to control the logic circuit. The other output is connected to a bit line which is connected to a sense amplifier. Finally, the switched input receives a switch signal and outputs the signal from the output node to either the one output or the other output.

Abstract: A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”).

Abstract: The present invention is a storage element for controlling a logic circuit and a logic device having a plurality of storage elements. The storage element has a first and a second non-volatile memory cells connected in series at an output node Each of the first and second non-volatile memory cells is for storing a state opposite to the other. A multiplexer has an input, a switched input and two outputs. The output node is connected to the input of the multiplexer. One of the outputs is used to control the logic circuit. The other output is connected to a bit line which is connected to a sense amplifier. Finally, the switched input receives a switch signal and outputs the signal from the output node to either the one output or the other output.

Abstract: A flash memory cell is of the type having a substrate of a first conductivity type having a first region of a second conductivity type at a first end, and a second region of the second conductivity type at a second end, spaced apart from the first end, with a channel region between the first end and the second end. The flash memory cell has a plurality of stacked pairs of floating gates and control gates with the floating gates positioned over portions of the channel region and are insulated therefrom, and each control gate over a floating gate and insulated therefrom. The flash memory cell further has a plurality of erase gates over the channel region which are insulated therefrom, with an erase gate between each pair of stacked pair of floating gate and control gate. In a method of erasing the flash memory cell, a pulse of a first positive voltage is applied to alternating erase gates (“first alternating gates”).

Abstract: A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate having a plurality of spaced apart isolation regions and active regions on the substrate substantially parallel to one another in the column direction. Floating gates are formed in trenches using a first layer of conducting material at the bottom of the trenches, and a second layer of conducting material along sidewalls of the trenches. An etch process is used to etch away portions of the first and second layers of the conductive material to form floating gate blocks of the conductive material having sloping portions that terminate in pointed edges formed along the trench sidewalls. The sharpness of the pointed edges are enhanced by the presence of the conductive material disposed along the trench sidewalls.

Abstract: A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate having a plurality of spaced apart isolation regions and active regions on the substrate substantially parallel to one another in the column direction. Floating gates are formed in trenches using a first layer of conducting material at the bottom of the trenches, and a second layer of conducting material along sidewalls of the trenches. An etch process is used to etch away portions of the first and second layers of the conductive material in to form floating gate blocks of the conductive material having sloping portions that terminate in pointed edges formed along the trench sidewalls. The sharpness of the pointed edges are enhanced by the presence of the conductive material disposed along the trench sidewalls.