Patents by Inventor Geert UBINK

Geert UBINK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10134650
    Abstract: A wafer cutting apparatus comprises a wafer positioning device for holding a wafer that is substantially covered with an opaque material such as molding compound and that has an exposed peripheral area, and for displacing the wafer relative to a wafer inspection system comprising a camera having a field of view. To perform visual data acquisition of said dicing street portions, the wafer is displaced such that a center of the camera's field of view follows a path along the exposed peripheral area of the wafer. A processing unit analyzes the visual data acquired for detecting or calculating locations and directions of the dicing streets. A wafer cutting tool cuts the wafer along straight lines between the dicing street portions which have been detected or calculated by the processing unit.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: November 20, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Guido Knippels, Geert Ubink, Jianfei Yang, Eric Meng Meng Tan, Marcel Boeren
  • Publication number: 20170243796
    Abstract: A wafer cutting apparatus comprises a wafer positioning device for holding a wafer that is substantially covered with an opaque material such as molding compound and that has an exposed peripheral area, and for displacing the wafer relative to a wafer inspection system comprising a camera having a field of view. To perform visual data acquisition of said dicing street portions, the wafer is displaced such that a centre of the camera's field of view follows a path along the exposed peripheral area of the wafer. A processing unit analyses the visual data acquired for detecting or calculating locations and directions of the dicing streets. A wafer cutting tool cuts the wafer along straight lines between the dicing street portions which have been detected or calculated by the processing unit.
    Type: Application
    Filed: February 19, 2016
    Publication date: August 24, 2017
    Inventors: Guido KNIPPELS, Geert UBINK, Jianfei YANG, Eric Meng Meng TAN, Marcel BOEREN