Abstract: The present invention relates to systems and methods for solid freeform fabrication, especially selective laser sintering, as well as various articles made using the same, where the systems and methods utilize certain thermoplastic polyurethanes which are particularly suited for such processing. The useful thermoplastic polyurethanes are derived from (a) a polyisocyanate component, (b) a polyol component, and (c) an optional chain extender component; wherein the resulting thermoplastic polyurethane has a melting enthalpy of at least 5.5J/g, a Tc (crystallization temperature) of more than 70° C., a ?(Tm:Tc) of from 20 to 75 degrees, where ?(Tm:Tc) is the difference between the Tm (melting temperature) and Tc.

Abstract: The present invention relates to systems and methods for solid freeform fabrication, especially selective laser sintering, as well as various articles made using the same, where the systems and methods utilize certain thermoplastic polyurethanes which are particularly suited for such processing. The useful thermoplastic polyurethanes are derived from (a) a polyisocyanate component, (b) a polyol component, and (c) an optional chain extender component; wherein the resulting thermoplastic polyurethane has a melting enthalpy of at least 5.5 J/g, a Tc (crystallization temperature) of more than 70° C., a ?(Tm:Tc) of from 20 to 75 degrees, where ?(Tm:Tc) is the difference between the Tm (melting temperature) and Tc.

Abstract: The present invention relates to systems and methods for solid freeform fabrication, especially selective laser sintering, as well as various articles made using the same, where the systems and methods utilize certain thermoplastic polyurethanes which are particularly suited for such processing. The useful thermoplastic polyurethanes are derived from (a) a polyisocyanate component, (b) a polyol component, and (c) an optional chain extender component; wherein the resulting thermoplastic polyurethane has a melting enthalpy of at least 5.5 J/g, a Tc (crystallization temperature) of more than 70° C., a ?(Tm:Tc) of from 20 to 75 degrees, where ?(Tm:Tc) is the difference between the Tm (melting temperature) and Tc.

Abstract: The present invention relates to systems and methods for solid freeform fabrication, especially selective laser sintering, as well as various articles made using the same, where the systems and methods utilize certain thermoplastic polyurethanes which are particularly suited for such processing. The useful thermoplastic polyurethanes are derived from (a) a polyisocyanate component, (b) a polyol component, and (c) an optional chain extender component; wherein the resulting thermoplastic polyurethane has a melting enthalpy of at least 5.5 J/g, a Tc (crystallization temperature) of more than 70° C., a ?(Tm:Tc) of from 20 to 75 degrees, where ?(Tm:Tc) is the difference between the Tm (melting temperature) and Tc.

Abstract: The present invention relates to systems and methods for solid freeform fabrication, especially selective laser sintering, as well as various articles made using the same, where the systems and methods utilize certain thermoplastic polyurethanes which are particularly suited for such processing. The useful thermoplastic polyurethanes are derived from (a) a polyisocyanate component, (b) a polyol component, and (c) an optional chain extender component; wherein the resulting thermoplastic polyurethane has a melting enthalpy of at least 5.5 J/g, a Tc (crystallization temperature) of more than 70° C., a ?(Tm:Tc) of from 20 to 75 degrees, where ?(Tm:Tc) is the difference between the Tm (melting temperature) and Tc.

Abstract: Protective film in the form of a tape or sheet comprising a substrate layer and a pressure sensitive adhesive composition.

Abstract: Protective film in the form of a tape or sheet comprising a substrate layer and a pressure sensitive adhesive composition.

Abstract: The present invention provides a poly(styrene-butadiene-styrene) polymer having a high vinyl content in the butadiene block. The polymer also has a polystyrene content from 15% to 20% by weight; a coupling efficiency from 50 to 80%; a styrene block molecular weight from 9,000 to 10,000 g/mol; a vinyl content from 20 to 45%; and a melt flow rate of equal to or greater than 10.

Abstract: A packaging tape adhesive composition for cardboard box sealing tapes, comprising: a linear tetrablock copolymer S—I—S—I?, obtainable by full sequential polymerization of predominantly styrene and of predominantly isoprene respectively, having an apparent molecular weight in the range of from 205,000 to 225,000, and wherein both predominantly poly(styrene) blocks have an apparent molecular weight of from 10,000 to 12,000, wherein the intermediate S—I diblock copolymer has an apparent molecular weight in the range of from 130,000 to 185,000, wherein the intermediate S—I—S triblock copolymer has an apparent molecular weight in the range of from 145,000 to 195,000, and wherein the poly(styrene) content is in the range of from 14 to 16 wt %, and at least one tackifying resin in an amount of from 50 to 150 parts by weight per 100 parts by weight of block copolymers; packaging tape for cardboard sealing derived from said packaging tape adhesive composition; the linear tetrablock copolymer for the preparation of sai

Abstract: The present invention concerns a poly(styrene-butadiene-styrene) polymer having a high vinyl content in the butadiene block comprising in combination a polystyrene content (PSC) within a range of 15-20 % by weight, a coupling efficiency (CE) of 50-80%, a step I molecular weight (MW) between 9,000 and 10,000 kg/mol, and a vinyl content between 2045%. Hot melt adhesive compositions are also described comprising said SBS polymer together with a tackifying resin, a plasticizer and an anti-oxidant.