Abstract: A digital baseband (DBB) receiver for receiving and processing a wireless communication signal. The DBB receiver includes at least one low noise amplifier (LNA), at least one demodulator, a direct current (DC) discharge circuit and an LNA control circuit. The LNA selectively amplifies the communication signal. The demodulator outputs analog real and imaginary signal components on real and imaginary signal paths, respectively, in response to receiving the communication signal from the LNA. The DC discharge circuit selectively discharges DC accumulating on at least one of the real and imaginary signal paths. The LNA control circuit turns the LNA on or off.

Abstract: A digital baseband (DBB) receiver for receiving and processing a wireless communication signal. The DBB receiver includes at least one low noise amplifier (LNA), at least one demodulator, a direct current (DC) discharge circuit and an LNA control circuit. The LNA selectively amplifies the communication signal. The demodulator outputs analog real and imaginary signal components on real and imaginary signal paths, respectively, in response to receiving the communication signal from the LNA. The DC discharge circuit selectively discharges DC accumulating on at least one of the real and imaginary signal paths. The LNA control circuit turns the LNA on or off.

Abstract: A method and system for adjusting the amplitude and phase characteristics of wireless communication signals generated by an analog radio transmitter, based on transmit power control (TPC) signals received by a base station (BS) and known characteristics of a power amplifier (PA) included in the transmitter. A digital pre-distortion compensation module, having real and imaginary signal paths, receives and processes real and imaginary signal components used to generate the wireless communication signal. The phase and amplitude characteristics of the wireless communication signal are controlled in response to the TPC signals, such that impaired amplitude and phase characteristics of the PA are corrected.

Abstract: A method for manufacturing a plurality or metal core substrates for a surface-mounted light emitting diode includes steps of adhering a pair of metal base plates and a plurality of insulation layers, adhering a pair of metal base plates interposing one of the insulation layers as a first insulation layer to form a set plate, stacking a plurality of set plates between a pair of guide plates, interposing a separation gap between adjacent set plates to form a set plate block, cutting the set plate block in a stacking direction to form a set plate aggregation, securing a second insulation layer to a cut surface of the set plate aggregation, securing a circuit pattern aggregation layer to the second insulation layer to form a metal core substrate aggregation, forming a separation groove on the circuit pattern aggregation layer between adjacent set plates, corresponding to the separation gap, forming a groove along a center line of the set plate to separate the set plate into first and second circuit pattern aggreg