Abstract: A wafer bonded CMUT array comprising a plurality of CMUT elements distributed across a substrates, each element comprising a cavity and a signal electrode formed in the substrate, and a conductive membrane closing the cavity and forming a ground electrode, wherein the membranes of the individual elements form an unbroken ground plane across the surface of the array and wherein electrical connection to the signal electrodes is provided by means of a conductive vias depending therefrom through the substrate from the signal electrode to the rear of the substrate.

Abstract: A spring scale, in particular for weighing loads in the ?g-mg range, comprises a load platform suspended by at least three flexural springs in a surrounding frame, and has bridge-connected strain gauges arranged for measuring strain on one side of the flexural springs. The flexural springs extend in succession along substantially the whole periphery of the load platform in a gap between the load platform and the inner edge of the frame, and an attachment spot on the load platform for every flexural spring is arranged substantially directly opposite or past an attachment spot on the inner edge of the frame for a next flexural spring in the succession of springs. Preferably, the spring scale is made in one piece, and manufactured by means of semiconductor process technology.