Abstract: An example of an isolation sensor package is disclosed to include a first Integrated Circuit (IC) chip and a second IC chip. The first IC chip may include an input interface circuit that receives an input signal from a first input signal terminal and a second input signal terminal, where the input signal ranges between a first positive voltage and a first negative voltage. The first IC chip may further include a negative voltage generator that generates a second negative voltage, a level shifter that receives an output of the input interface circuit and generates a modified signal having a voltage level between a ground voltage provided to the ground terminal and a second positive voltage that is present at a voltage supply terminal. The first IC chip may further produce a signal based on the modified signal generated by the level shifter.

Abstract: A sensor, optical system, and combination lens for use with an optical sensor are disclosed. An illustrative optical system is described to include a photodetector having a proximity sensor area and an ambient light sensor area that is physically separated from the proximity sensor area as well as a combination lens that includes a proximity sensor focusing portion and an ambient light sensor focusing portion that each separately direct incident light for the proximity sensor area and the ambient light sensor area, respectively.

Abstract: An isolation system and isolation device are disclosed. An illustrative isolation device is disclosed to include a transmitter side and receiver side separated by an isolation material. One or more components of the transmitter side operate on a clock signal whereas one or more components of the receiver side operate on a scrambled clock signal. The scrambled clock signal is generated to have a different energy distribution than the clock signal and is also generated to have a dominant peak value that is lower than the dominant peak value of the clock signal.

Abstract: An isolation system and isolation device are disclosed. An illustrative isolation device is disclosed to include a transmitter side and receiver side separated by an isolation material. One or more components of the transmitter side operate on a clock signal whereas one or more components of the receiver side operate on a scrambled clock signal. The scrambled clock signal is generated to have a different energy distribution than the clock signal and is also generated to have a dominant peak value that is lower than the dominant peak value of the clock signal.

Abstract: An optical sensor and optical system are disclosed. The optical sensor is disclosed to include a light source, a photodetector having a proximity sensing portion and an ambient light sensing portion, and a controller configured to implement a proximity sensing phase where the proximity sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is ON and then implement an ambient light sensing phase where the ambient light sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is OFF.

Abstract: A sensor, optical system, and combination lens for use with an optical sensor are disclosed. An illustrative optical system is described to include a photodetector having a proximity sensor area and an ambient light sensor area that is physically separated from the proximity sensor area as well as a combination lens that includes a proximity sensor focusing portion and an ambient light sensor focusing portion that each separately direct incident light for the proximity sensor area and the ambient light sensor area, respectively.

Abstract: An optical sensor and optical system are disclosed. The optical sensor is disclosed to include a light source, a photodetector having a proximity sensing portion and an ambient light sensing portion, and a controller configured to implement a proximity sensing phase where the proximity sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is ON and then implement an ambient light sensing phase where the ambient light sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is OFF.

Abstract: Various embodiments of systems for transmitting and receiving a plurality of signals across an isolation material are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal using amplitude modulation. In another embodiment, a first signal and a second signal are modulated into a modulated signal before being modulated further using amplitude modulation. The detection of the modulated signal may be performed using a frequency detector and an amplitude detection circuit that are arranged in parallel. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques to provide, for example, at least one or more integrated circuits.

Abstract: A sigma-delta converter, analog-to-digital conversion system, and an Integrated Circuit (IC) chip are disclosed that include a main sigma-delta modulator and an auxiliary sigma-delta modulator. The auxiliary sigma-delta modulator is electrically matched with the main sigma-delta modulator and is configured to generate an output that is incorporated into a feedback loop of the main sigma-delta modulator to enable the main sigma-delta modulator to adjust an offset signal applied at a main analog channel.

Abstract: Various embodiments of systems for transmitting and receiving a plurality of signals across an isolation material are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal using amplitude modulation. In another embodiment, a first signal and a second signal are modulated into a modulated signal before being modulated further using amplitude modulation. The detection of the modulated signal may be performed using a frequency detector and an amplitude detection circuit that are arranged in parallel. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques to provide, for example, at least one or more integrated circuits.

Abstract: A communication system implementing one or more a Light Emitting Diodes (LEDs) and a driver circuit for the same is disclosed. A method of driving the one or more LEDs is also disclosed. The driver circuit is disclosed to include a first input branch and a second input branch. The first input branch provides a first driving current to the one or more LEDs and the second input branch selectively provides a second driving current to the one or more LEDs. The magnitude of the second driving current is adjustable in response to variations in at least one characteristic of the one or more LEDs.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.

Abstract: Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal. The second modulated signal is in turn, modulated into a third modulated signal in accordance to a third signal. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, at least one or more integrated circuits.

Abstract: Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal. The second modulated signal is in turn, modulated into a third modulated signal in accordance to a third signal. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, at least one or more integrated circuits.

Abstract: Various embodiments of systems for transmitting and receiving digital and Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, the digital and analog signals may be modulated into a frequency modulated signal, and each pulse of the frequency modulated signal may be further encoded into a major pulse and a minor pulse. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: Various embodiments of an optical proximity sensor and corresponding circuits and methods for measuring small AC signal currents arising from the detection of pulsed AC light signals emitted by a light emitter and reflected from an object to detected in the presence of larger ambient light DC current signals are disclosed. Circuits and corresponding methods are described that improve the dynamic range, sensitivity and detection range of an optical proximity sensor by cancelling the contributions of DC current signals arising from ambient light signals that otherwise would dominate the detected small AC signal currents. The DC signal cancellation occurs in a differential amplifier circuit before small AC signal currents are provided to an analog-to-digital converter. The circuits and methods may be implemented using conventional CMOS design and manufacturing techniques and processes.

Abstract: According to one embodiment, there is provided a method of reducing the amount of power consumed by a galvanic isolator. A transmitter transmits a wake-up signal to a receiver located across an isolation medium when the transmitter is ready or preparing to transmit data or power signals to a receiver, which is operably connected to a sensing circuit. The sensing circuit receives the wake-up signal through the isolation medium, which may be operably connected to and powered substantially continuously or intermittently by a first power source. In response to the sensing circuit receiving the wake-up signal, the receiver is powered up from a sleep mode to an operating mode. After a period of time tRDY has passed since the wake-up signal was transmitted, a signature pattern is transmitted from the transmitter to the sensing circuit through the isolation medium. Next, the sensing circuit or the receiver verifies the validity of the signature pattern.

Abstract: Various embodiments of systems for transmitting and receiving digital and Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, the digital and analog signals may be modulated into a frequency modulated signal, and each pulse of the frequency modulated signal may be further encoded into a major pulse and a minor pulse. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: Various embodiments of systems for transmitting and receiving digital and analog signals across a single isolator, solid state lighting systems, and DC/DC converter feedback regulation control systems are disclosed. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.