Abstract: This document describes an integrated microphone configuration for reducing electronic and mechanical noise in electronic devices. In aspects, a microphone is integrated within a housing of an electronic device that includes a plurality of electronic components. The housing of the electronic device includes a microphone port that defines a cavity extending from an exterior surface to an interior surface of the housing. The microphone port enables acoustic waves to propagate through the cavity to be detected by the microphone. A waterproof mesh is positioned within the microphone port and defines an interstitial volume between the waterproof mesh and the microphone. A cosmetic mesh is also positioned within the microphone port, above the waterproof mesh. The waterproof mesh and the cosmetic mesh are positioned in such a manner to reduce an electronic and/or mechanical noise originating from electronic components within the electronic device.

Abstract: This document describes an integrated microphone configuration for reducing electronic and mechanical noise in electronic devices. In aspects, a microphone is integrated within a housing of an electronic device that includes a plurality of electronic components. The housing of the electronic device includes a microphone port that defines a cavity extending from an exterior surface to an interior surface of the housing. The microphone port enables acoustic waves to propagate through the cavity to be detected by the microphone. A waterproof mesh is positioned within the microphone port and defines an interstitial volume between the waterproof mesh and the microphone. A cosmetic mesh is also positioned within the microphone port, above the waterproof mesh. The waterproof mesh and the cosmetic mesh are positioned in such a manner to reduce an electronic and/or mechanical noise originating from electronic components within the electronic device.

Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.

Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.

Abstract: A wearable audio device sized to fit within an ear of an user comprises an outer housing; a circuit board positioned within the outer housing; a battery having an anode and a cathode, the battery being connected to the circuit board; a speaker adjacent the battery; and an electromagnetic interference (“EMI”) shield tab coupled to the anode. The EMI shield tab may be configured to shield the speaker from EMI generated by the circuit board and to provide an electrical interconnection to the anode.

Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.

Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.

Abstract: A wearable audio device sized to fit within an ear of an user comprises an outer housing; a circuit board positioned within the outer housing; a battery having an anode and a cathode, the battery being connected to the circuit board; a speaker adjacent the battery; and an electromagnetic interference (“EMI”) shield tab coupled to the anode. The EMI shield tab may be configured to shield the speaker from EMI generated by the circuit board and to provide an electrical interconnection to the anode.

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Abstract: Passive component structures that may save space, are readily manufactured, and are easy to use. In one example, a passive component structure may include two capacitors, each formed as a group of plates separate and apart from the other. The two groups of plates may have a spacing layer between them.

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.