Patents by Inventor Gemin Li

Gemin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240064453
    Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Applicant: Google LLC
    Inventors: Shengyin Ding, Gemin Li, Yao Ding, Jianmin Zhang, Guohua Sun
  • Patent number: 11832428
    Abstract: A wearable audio device sized to fit within an ear of an user comprises an outer housing; a circuit board positioned within the outer housing; a battery having an anode and a cathode, the battery being connected to the circuit board; a speaker adjacent the battery; and an electromagnetic interference (“EMI”) shield tab coupled to the anode. The EMI shield tab may be configured to shield the speaker from EMI generated by the circuit board and to provide an electrical interconnection to the anode.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: November 28, 2023
    Assignee: Google LLC
    Inventors: Yao Ding, Troy Edwards, Gemin Li
  • Patent number: 11812216
    Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: November 7, 2023
    Assignee: Google LLC
    Inventors: Shengyin Ding, Gemin Li, Yao Ding, Jianmin Zhang, Guohua Sun
  • Publication number: 20230262376
    Abstract: The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 17, 2023
    Inventors: Shengyin Ding, Gemin Li, Yao Ding, Jianmin Zhang, Guohua Sun
  • Publication number: 20230014566
    Abstract: A wearable audio device sized to fit within an ear of an user comprises an outer housing; a circuit board positioned within the outer housing; a battery having an anode and a cathode, the battery being connected to the circuit board; a speaker adjacent the battery; and an electromagnetic interference (“EMI”) shield tab coupled to the anode. The EMI shield tab may be configured to shield the speaker from EMI generated by the circuit board and to provide an electrical interconnection to the anode.
    Type: Application
    Filed: July 19, 2021
    Publication date: January 19, 2023
    Inventors: Yao Ding, Troy Edwards, Gemin Li
  • Patent number: 10431382
    Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: October 1, 2019
    Assignee: Apple Inc.
    Inventors: Gemin Li, Paul Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson, Curtis C. Mead, Kieran Poulain, Sung Woo Yoo, Nelson J. Kottke
  • Publication number: 20180061578
    Abstract: Passive component structures that may save space, are readily manufactured, and are easy to use. In one example, a passive component structure may include two capacitors, each formed as a group of plates separate and apart from the other. The two groups of plates may have a spacing layer between them.
    Type: Application
    Filed: September 1, 2017
    Publication date: March 1, 2018
    Applicant: Apple Inc.
    Inventors: Gang Ning, Paul A. Martinez, Amanda R. Rainer, Won Seop Choi, Gemin Li, Zhong-Qing Gong, Shawn X. Arnold
  • Publication number: 20170064811
    Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventors: Gemin Li, Paul Martinez, Benjamin A. Bard, Connor R. Duke, Zhong-Qing Gong, Kevin R. Richardson, Curtis C. Mead, Kieran Poulain, Sung Woo Yoo, Nelson J. Kottke