Patents by Inventor Gen-Cai Wang

Gen-Cai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7327573
    Abstract: A heat sink clip (1) includes a main body (10), a post (40), a spring (50) and a cammed handle (30). The main body includes a horizontal portion (12) and two locking arms (16). A locking hole (17) is defined in an end of each locking arm for engaging with catches (82) of a socket (80). The post has a pressing block (44) at a bottom portion and a cutout (42) at a top portion. The spring is placed around the post and rests on the pressing block The post extends through a through aperture (13) of the horizontal portion, and the cutout pivotally receives a cam (32) at one end of the handle. When the handle is pressed, the horizontal portion of the main body is raised by the decompressed spring, so that the locking arms tightly engage with the catches of the socket.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: February 5, 2008
    Inventors: Hsieh Kun Lee, Wellint Xia, Toly Lee, Gen-Cai Wang
  • Patent number: 7277288
    Abstract: A heat sink assembly of the present invention includes a printed circuit board (10), a retention module (20), four pins (30), a heat sink (40) and a clip (50). The printed circuit board (10) has an electronic package (100) mounted thereon. The retention module (20) is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module (20) defines an opening (26) therein for surrounding the electronic package (100). Four positioning holes (28) are defined in four corners of the retention module (20). In assembly of the heat sink assembly, the pins (30) are interferentially positioned in the positioning holes (28) of the retention module (20). Portions of the pins (30) extending out beyond the retention module (20) are welded to the printed circuit board (10). The clip (50) cooperates with the retention module (20) to press the heat sink (40) against the electronic package (100).
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: October 2, 2007
    Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh Kun Lee, WanLin Xia, Gen-Cai Wang, Tao Li
  • Patent number: 7269016
    Abstract: A heat dissipating device includes a heat sink and a clip attached on the heat sink. The heat sink includes a solid trunk and a plurality of fins extending radially outwardly from a circumference of the trunk. A rectangular extension portion is formed at a bottom end of the trunk. A pressing portion extends from the extension portion and abuts against the clip toward the heat sink in an axial direction of the heat sink. The clip defines a rectangular opening fittingly receiving the extension portion to thereby form a positioning structure for preventing the clip from moving relative to the heat sink in a circumferential direction of the heat sink.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: September 11, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jin-Liang Wang, Gen-Cai Wang, Wei-Guo Zhou
  • Publication number: 20060274503
    Abstract: A heat sink clip (1) includes a main body (10), a post (40), a spring (50) and a cammed handle (30). The main body includes a horizontal portion (12) and two locking arms (16). A locking hole (17) is defined in an end of each locking arm for engaging with catches (82) of a socket (80). The post has a pressing block (44) at a bottom portion and a cutout (42) at a top portion. The spring is placed around the post and rests on the pressing block The post extends through a through aperture (13) of the horizontal portion, and the cutout pivotally receives a cam (32) at one end of the handle. When the handle is pressed, the horizontal portion of the main body is raised by the decompressed spring, so that the locking arms tightly engage with the catches of the socket.
    Type: Application
    Filed: July 25, 2003
    Publication date: December 7, 2006
    Inventors: Hsieh Lee, Wellint Xia, Toly Lee, Gen-Cai Wang
  • Patent number: 7142426
    Abstract: A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: November 28, 2006
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Gen-Cai Wang, Di-Qiong Zhao, Yi-Chyng Fang
  • Patent number: 7139171
    Abstract: A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: November 21, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Gen-Cai Wang, Yi-Chyng Fang
  • Publication number: 20060126303
    Abstract: A heat dissipating device includes a heat sink and a clip attached on the heat sink. The heat sink includes a solid trunk and a plurality of fins extending radially outwardly from a circumference of the trunk. A rectangular extension portion is formed at a bottom end of the trunk. A pressing portion extends from the extension portion and abuts against the clip toward the heat sink in an axial direction of the heat sink. The clip defines a rectangular opening fittingly receiving the extension portion to thereby form a positioning structure for preventing the clip from moving relative to the heat sink in a circumferential direction of the heat sink.
    Type: Application
    Filed: May 25, 2005
    Publication date: June 15, 2006
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Jin-Liang Wang, Gen-Cai Wang, Wei-Guo Zhou
  • Patent number: 7019978
    Abstract: A heat dissipating device for a heat generating unit, includes a heat sink placed on the heat generating unit, and two clip members located at opposite sides of the heat sink for securing the heat sink to the heat generating unit. Each clip member includes an operating member movably attached to the heat sink, and a fastening member connected with the operating member. The operating member is movable from a lower position to an upper position to cause the bottom portion of the fastening member to move upwardly via the operating member acting on the fastening member.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: March 28, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei-Guo Zhou, Gen-Cai Wang, Xiao-Yan Tang
  • Patent number: 7009843
    Abstract: A heat sink clip (20) includes a main body, a post (26), and a spring (27). The main body includes a longitudinal portion (31), first and second locking arms (32, 24) extending downwardly from opposite ends of the longitudinal portion. The longitudinal portion defines a through aperture (36) in a middle thereof. Two hooks (38, 46) are respectively formed at free ends of the first and second locking arms for engagement with catches (52) of a socket (52). The post has a pressing portion at a bottom thereof for being fittingly received in a blind hole (16) of a heat sink (10). The post extends through the through aperture of the longitudinal portion. The resilient element is disposed around the post below the longitudinal portion.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: March 7, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Wellint Xia, Toly Lee, Gen-Cai Wang
  • Publication number: 20060034058
    Abstract: A heat dissipating device includes a heat sink forming a pressing portion thereon and a clip. The heat sink includes a hollow dissipating member and a column-shaped core, and the clip includes an integrally formed body defining a round hole therein. The pressing portion extends beyond the clip and presses the body of the clip on the heat sink. The method for manufacturing the heat dissipating device as above-mentioned includes the following steps: providing a heat sink with a collar formed thereon; providing a clip on the heat sink with the collar extending beyond the clip; having the collar deformed under pressure to form a pressing portion pressing the clip on the heat sink.
    Type: Application
    Filed: December 17, 2004
    Publication date: February 16, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Gen-Cai Wang, Di-Qiong Zhao, Yi-Chyng Fang
  • Publication number: 20050207118
    Abstract: A heat dissipation device includes a heat sink (50) and a fan (10) located above the heat sink for providing airflow. The heat sink includes a base (40) and a heat dissipating part (30) arranged on the base. The heat dissipating part includes a plurality of fins (31), each adjacent pair of the fins defines a channel (35) therebetween. The heat dissipating part defines a plurality of passages (34) disposed diagonally thereat and perpendicular to the channels. The channels and the passages are oriented consistently with the airflow of the fan.
    Type: Application
    Filed: December 21, 2004
    Publication date: September 22, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Gen-Cai Wang, Yi-Chyng Fang
  • Publication number: 20050180114
    Abstract: A heat dissipating device for a heat generating unit, includes a heat sink placed on the heat generating unit, and two clip members located at opposite sides of the heat sink for securing the heat sink to the heat generating unit. Each clip member includes an operating member movably attached to the heat sink, and a fastening member connected with the operating member. The operating member is movable from a lower position to an upper position to cause the bottom portion of the fastening member to move upwardly via the operating member acting on the fastening member.
    Type: Application
    Filed: July 15, 2004
    Publication date: August 18, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Wei-Guo Zhou, Gen-Cai Wang, Xiao-Yan Tang
  • Patent number: 6876551
    Abstract: A heat sink assembly includes a heat sink (30), a processing unit (70), a socket (40) and a clip (1). The processing unit is mounted on the socket. Two catches (42) are provided at opposite sides of the socket. The clip includes a operating member (10) and a pressing member (20). The operating member includes a main body (14) and a handle (12). Two resilient portions (142) are formed from opposite sides of the main body. A first latching leg (146) with a fixing hole (144) extends downwardly from the main body. The pressing member includes two opposite pressing portions (24), and opposite first and second beams (22,26). A second latching leg (224) with a fixing hole (222) extends downwardly from the first beam. Two cutouts (262) are defined at a side of the pressing member, the resilient portions snappingly engaging with the pressing member in the cutouts.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: April 5, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Wellint Xia, Gen-Cai Wang
  • Publication number: 20050024832
    Abstract: A heat sink clip (20) includes a main body, a post (26), and a spring (27). The main body includes a longitudinal portion (31), first and second locking arms (32, 24) extending downwardly from opposite ends of the longitudinal portion. The longitudinal portion defines a through aperture (36) in a middle thereof. Two hooks (38, 46) are respectively formed at free ends of the first and second locking arms for engagement with catches (52) of a socket (52). The post has a pressing portion at a bottom thereof for being fittingly received in a blind hole (16) of a heat sink (10). The post extends through the through aperture of the longitudinal portion. The resilient element is disposed around the post below the longitudinal portion.
    Type: Application
    Filed: July 25, 2003
    Publication date: February 3, 2005
    Inventors: Hsieh Lee, Wellint Xia, Toly Lee, Gen-Cai Wang
  • Publication number: 20040120119
    Abstract: A heat sink assembly includes a heat sink (30), a processing unit (70), a socket (40) and a clip (1). The processing unit is mounted on the socket. Two catches (42) are provided at opposite sides of the socket. The clip includes a operating member (10) and a pressing member (20). The operating member includes a main body (14) and a handle (12). Two resilient portions (142) are formed from opposite sides of the main body. A first latching leg (146) with a fixing hole (144) extends downwardly from the main body. The pressing member includes two opposite pressing portions (24), and opposite first and second beams (22,26). A second latching leg (224) with a fixing hole (222) extends downwardly from the first beam. Two cutouts (262) are defined at a side of the pressing member, the resilient portions snappingly engaging with the pressing member in the cutouts.
    Type: Application
    Filed: September 17, 2003
    Publication date: June 24, 2004
    Inventors: Hsieh Kun Lee, Wellint Xia, Gen-Cai Wang
  • Publication number: 20040105236
    Abstract: A heat sink assembly of the present invention includes a printed circuit board (10), a retention module (20), four pins (30), a heat sink (40) and a clip (50). The printed circuit board has an electronic package (100) mounted thereon. The retention module is integrally formed, substantially rectangular, and has a symmetrical configuration. The retention module defines an openings (26) therein for surrounding the electronic package. Four positioning holes (28) are defined in four corners of the retention module. In assembly of the heat sink assembly, the pins are interferentially positioned in the positioning holes of the retention module. Portions of the pins extending out beyond the retention module are welded to the printed circuit board. The clip cooperates with the retention module to press the heat sink against the electronic package.
    Type: Application
    Filed: July 28, 2003
    Publication date: June 3, 2004
    Inventors: Hsieh Kun Lee, WanLin Xia, Gen-Cai Wang, Tao Li