Abstract: A semiconductor storage includes a stack, columns, and first, second, third, fourth, and fifth insulators. The stack includes first conductive layers, and second and third conductive layers below and above the first conductive layers, respectively. The columns penetrate the stack in a first direction. The first and second insulators penetrate the stack and are separated from each other in a second direction. The third insulator is between the first and second insulators in a third direction. The third insulator includes first and second portions apart from each other in the second direction. The fourth insulator is between the first and second portions. The fifth insulator is between the first and second portions above the fourth insulator. The second conductive layer includes two electrically-separated regions, between which the third and fourth insulators are provided. The third conductive layer includes two electrically-separated regions between which the third and fifth insulators are provided.

Abstract: The present invention has an object of providing an arithmetic apparatus, a facility management method, and a program that make it possible to acquire current tension applied to outdoor structures in a short period of time and make a bearing determination. The arithmetic apparatus according to the present invention calculates the dip degree of a cable and a distance between poles from the 3D model data of the cable according to Math. C1 and calculates the tension of each cable between the poles from the dip degree, the distance between the poles, and the weight of the cable per unit length according to Math. C2 (when no wind blows) or Math. C4 (when wind blows). Further, the arithmetic apparatus according to the present invention calculates a combined load obtained by converting the tension and the load of the accessory of the poles into an arbitrary position on the poles according to Math. C3.

Abstract: An object of the present invention is to provide a facility state analysis apparatus, a facility state analysis method, and a program capable of extracting a pole having a high risk without an inspector visiting a site. The facility state analysis apparatus according to the present invention creates a pole model from a material characteristic, dimensions, and a structure model of a pole, highly accurately estimates, by using a finite element method, a facility state such as deflection and an inclination when tension by a separately created cable model is applied to the pole model, and visualizes strength remaining in a facility system.

Abstract: An object of the present invention is to provide an equipment state detecting device, an equipment state detecting method, and a program that can create a 3D model of a cable based on three-dimensional coordinates acquired using a laser scanner or the like, and precisely estimate the tension for the entirety of the cable even if the entirety of the cable is not three-dimensionally modeled in the cable model. An equipment state detecting device of the present invention creates a 3D model of a cable based on three-dimensional coordinates acquired using a laser scanner or the like, acquires a sag and a straight line connecting ends of the 3D model based on the 3D model, and calculates the tension of the cable using a known cable load per unit length.

Abstract: Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20° C./W or less, a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator, and a method of producing a heat conductive sheet.

Abstract: Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having an Asker C hardness at 25° C. of 60 or more and a thermal resistance value under a pressure of 0.5 MPa of 0.20° C./W or less, a method of producing a heat conductive sheet, and a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator.

Abstract: A thermally conductive sheet includes a resin that is liquid under normal temperature and pressure, a resin that is solid under normal temperature and pressure, and a particulate carbon material, and the thermal resistance of the thermally conductive sheet under a pressure of 0.05 MPa is at most 0.30° C/W. In the thermally conductive sheet, the resin that is solid under normal temperature and pressure is preferably a thermoplastic fluororesin that is solid under normal temperature and pressure, and the resin that is liquid under normal temperature and pressure is preferably a thermoplastic fluororesin that is liquid under normal temperature and pressure.

Abstract: Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20° C./W or less, a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator, and a method of producing a heat conductive sheet.

Abstract: Provided is a heat radiation device that can achieve high heat radiation. A heat radiation device comprises: a heat generator; a heat radiator; and a heat conductive sheet attached in a sandwiched manner between the heat generator and the heat radiator, wherein a heat conductivity of the heat conductive sheet in a thickness direction is 15 W/m·K or more, and an area of a sandwiched surface of the heat conductive sheet is smaller than an area of an attached surface of the heat generator and the heat radiator.

Abstract: Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having an Asker C hardness at 25° C. of 60 or more and a thermal resistance value under a pressure of 0.5 MPa of 0.20° C./W or less, a method of producing a heat conductive sheet, and a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator.

Abstract: A thermally conductive sheet includes a resin that is liquid under normal temperature and pressure, a resin that is solid under normal temperature and pressure, and a particulate carbon material, and the thermal resistance of the thermally conductive sheet under a pressure of 0.05 MPa is at most 0.30° C./W. In the thermally conductive sheet, the resin that is solid under normal temperature and pressure is preferably a thermoplastic fluororesin that is solid under normal temperature and pressure, and the resin that is liquid under normal temperature and pressure is preferably a thermoplastic fluororesin that is liquid under normal temperature and pressure.