Patents by Inventor Gen Murakamz

Gen Murakamz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device
    Patent number: 6506627
    Abstract: A structure of a semiconductor device of a chip scale package structure is provided. In the semiconductor device, the limitation to size reduction due to the bonding tool is small and the bonding pitch of the semiconductor chip can be reduced to 100 &mgr;m or less, and the chip shrink technique of a technique for lowering the cost can be employed and in connection with this compatibility among packages can be kept.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: January 14, 2003
    Assignee: Hitachi Cable, Ltd.
    Inventors: Gen Murakamz, Mamoru Mita, Norio Okabe, Yasuharu Kameyama
  • Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device
    Patent number: 6323058
    Abstract: A structure of a semiconductor device of a CSP structure is provided. In the semiconductor device, the limitation by the bonding tool is small and the bonding pitch of the semiconductor chip can be reduced to 100 &mgr;m or less, and the chip shrink technique of a technique for lowering the cost can be employed and in connection with this, compatibility among packages can be kept.
    Type: Grant
    Filed: July 29, 1998
    Date of Patent: November 27, 2001
    Assignee: Hitachi Cable Ltd.
    Inventors: Gen Murakamz, Mamoru Mita, Norio Okabe, Yasuharu Kameyama