Patents by Inventor Gen TOKUYAMA

Gen TOKUYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and electronic device
    Patent number: 8787033
    Abstract: An electronic component to be mounted on a substrate, including an electronic component-side land that faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate. A non-soldered region is provided on a surface of the electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the electronic component-side land facing the substrate-side land.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: July 22, 2014
    Assignee: Aisin AW Co., Ltd.
    Inventors: Hitoshi Nakagawa, Gen Tokuyama, Yuki Mizuno
  • ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
    Publication number: 20120106116
    Abstract: An electronic component to be mounted on a substrate, including an electronic component-side land that faces a substrate-side land provided on the substrate when the electronic component is mounted on the substrate. A non-soldered region is provided on a surface of the electronic component-side land, facing the substrate-side land, so that a shape of the substrate-side land is different from a shape of the electronic component-side land facing the substrate-side land.
    Type: Application
    Filed: September 16, 2011
    Publication date: May 3, 2012
    Applicant: AISIN AW CO., LTD.
    Inventors: Hitoshi NAKAGAWA, Gen TOKUYAMA, Yuki MIZUNO