Patents by Inventor Gen Toyota
Gen Toyota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240055363Abstract: There is provided a semiconductor device including a first chip and a second chip bonded to the first chip. The first chip includes a first alignment mark provided in a first region of a bonding surface and a plurality of first dummy pads provided in a second region of the bonding surface different from the first region. The second chip includes a second alignment mark provided on the bonding surface corresponding to the first alignment mark and a plurality of second dummy pads provided in a region of the bonding surface different from the second alignment mark. A coverage of the first alignment mark in the first region is substantially the same as the coverage of the first dummy pads in the second region.Type: ApplicationFiled: August 8, 2023Publication date: February 15, 2024Applicant: Kioxia CorporationInventors: Susumu YAMAMOTO, Hideki MATSUSHIGE, Gen TOYOTA
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Publication number: 20230411287Abstract: A semiconductor device includes a wiring layer; a first stacked body disposed on the wiring layer; a second stacked body disposed on the first stacked body in a stacking direction; and a first resin body disposed around a periphery of the first stacked body. The first stacked body includes a first pad electrically connected to the wiring layer, a first device layer electrically connected to the first pad, and a first electrode electrically connected to the first device layer. The second stacked body includes a second pad electrically connected to the first electrode and a second device layer electrically connected to the second pad. In the stacking direction, the first resin body is vertically located closer to the wiring layer than an interface between the first stacked body and the second stacked body.Type: ApplicationFiled: March 3, 2023Publication date: December 21, 2023Applicant: Kioxia CorporationInventors: Eiichi SHIN, Satoshi HONGO, Susumu YAMAMOTO, Yukio KATAMURA, Gen TOYOTA, Tsutomu FUJITA
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Patent number: 11830847Abstract: According to one embodiment, a manufacturing method of a semiconductor device is provided. The manufacturing method includes removing a portion of an edge region from a front surface of a first substrate to form a notch in the edge region; bonding the front surface of the first substrate and a front surface of a second substrate together to forma stacked substrate, wherein the stack substrate includes an opening at a position corresponding to the notch; and filling the opening with an embedding member.Type: GrantFiled: August 23, 2021Date of Patent: November 28, 2023Assignee: KIOXIA CORPORATIONInventor: Gen Toyota
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Publication number: 20230307415Abstract: According to one embodiment, a semiconductor device includes a base substrate with an interconnection layer and a plurality of chips stacked on the base substrate. A protective film is between each adjacent pair of chips in the plurality of chips stacked on the base substrate and on side surfaces of at least each chip in the plurality other than an uppermost chip in the stacked plurality of chips. A lowermost chip in the stacked plurality of chips has a metal pad electrically connected to the interconnection layer. Each chip in an adjacent pair of chips in the plurality of chips stacked on the base substrate has an electrode contacting an electrode of the other chip in the adjacent pair.Type: ApplicationFiled: August 30, 2022Publication date: September 28, 2023Inventors: Satoshi HONGO, Tatsuo MIGITA, Gen TOYOTA
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Publication number: 20230101002Abstract: A semiconductor device including a base substrate B, which includes wire layers, chips C1, C2, C3, C4, C5, and C6 provided on the base substrate B, and a protective film P provided on each of the side faces of the chips C1, C2, C3, C4, C5, and C6.Type: ApplicationFiled: March 14, 2022Publication date: March 30, 2023Applicant: Kioxia CorporationInventors: Gen TOYOTA, Satoshi HONGO, Tatsuo MIGITA, Susumu YAMAMOTO, Tsutomu FUJITA, Eiichi SHIN, Yukio KATAMURA, Hideki MATSUSHIGE, Kazuki TAKAHASHI
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Publication number: 20220375901Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming a plurality of stacked bodies on a substrate, each of the stacked bodies includes a plurality of semiconductor chips. The method further includes forming a plurality of first wires on the stacked bodies. The first wires connecting the stacked bodies to each other. The method further includes forming a resin layer on the stacked bodies and the first wires, then thinning he resin layer until the first wires are exposed.Type: ApplicationFiled: February 28, 2022Publication date: November 24, 2022Inventors: Susumu YAMAMOTO, Tsutomu FUJITA, Takeori MAEDA, Satoshi HONGO, Gen TOYOTA, Eiichi SHIN, Yukio KATAMURA
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Publication number: 20220077106Abstract: According to one embodiment, a manufacturing method of a semiconductor device is provided. The manufacturing method includes removing a portion of an edge region from a front surface of a first substrate to form a notch in the edge region; bonding the front surface of the first substrate and a front surface of a second substrate together to forma stacked substrate, wherein the stack substrate includes an opening at a position corresponding to the notch; and filling the opening with an embedding member.Type: ApplicationFiled: August 23, 2021Publication date: March 10, 2022Applicant: Kioxia CorporationInventor: Gen TOYOTA
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Patent number: 10818501Abstract: A method for manufacturing a semiconductor device includes bonding a supporting substrate and a first surface of a semiconductor substrate via a bonding layer, processing a second surface of the supporting substrate, opposite to the first surface, to shape the semiconductor substrate into a thin film. After shaping the semiconductor substrate into a thin film, polishing a part of the bonding layer formed at a beveled portion of the supporting substrate or the semiconductor substrate with a first polishing plane to remove the part of the bonding layera A33fter polishing the part of the bonding layer, polishing a remaining part of the bonding layer formed at the beveled portion of the supporting substrate or the semiconductor substrate with a second polishing plane different from the first polishing plane to remove the remaining part of the bonding layer.Type: GrantFiled: February 11, 2019Date of Patent: October 27, 2020Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takashi Shirono, Eiji Takano, Gen Toyota, Eiichi Shin
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Publication number: 20190362980Abstract: A method for manufacturing a semiconductor device includes bonding a supporting substrate and a first surface of a semiconductor substrate via a bonding layer, processing a second surface of the supporting substrate, opposite to the first surface, to shape the semiconductor substrate into a thin film. After shaping the semiconductor substrate into a thin film, polishing a part of the bonding layer formed at a beveled portion of the supporting substrate or the semiconductor substrate with a first polishing plane to remove the part of the bonding layera A33fter polishing the part of the bonding layer, polishing a remaining part of the bonding layer formed at the beveled portion of the supporting substrate or the semiconductor substrate with a second polishing plane different from the first polishing plane to remove the remaining part of the bonding layer.Type: ApplicationFiled: February 11, 2019Publication date: November 28, 2019Applicant: Toshiba Memory CorporationInventors: Takashi SHIRONO, Eiji TAKANO, Gen TOYOTA, Eiichi SHIN
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Patent number: 9935232Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes a step of grinding to thin a first semiconductor wafer on which a semiconductor device is formed in a state in which a surface of a second semiconductor wafer is fixed on a chuck table of a grinding device after bonding the first semiconductor wafer to the second semiconductor wafer. The method includes a step of fixing a surface of the first semiconductor wafer on the chuck table and grinding the surface of the second semiconductor wafer in a state in which the first semiconductor wafer is bonded to the second semiconductor wafer prior to the grinding step to thin the first semiconductor wafer.Type: GrantFiled: November 4, 2015Date of Patent: April 3, 2018Assignee: Toshiba Memory CorporationInventors: Gen Toyota, Shouta Inoue, Susumu Yamamoto, Takamasa Tanaka, Takamitsu Yoshida, Kazumasa Tanida
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Publication number: 20160268469Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes a step of grinding to thin a first semiconductor wafer on which a semiconductor device is formed in a state in which a surface of a second semiconductor wafer is fixed on a chuck table of a grinding device after bonding the first semiconductor wafer to the second semiconductor wafer. The method includes a step of fixing a surface of the first semiconductor wafer on the chuck table and grinding the surface of the second semiconductor wafer in a state in which the first semiconductor wafer is bonded to the second semiconductor wafer prior to the grinding step to thin the first semiconductor wafer.Type: ApplicationFiled: November 4, 2015Publication date: September 15, 2016Inventors: Gen Toyota, Shouta Inoue, Susumu Yamamoto, Takamasa Tanaka, Takamitsu Yoshida, Kazumasa Tanida
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Patent number: 8292694Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.Type: GrantFiled: November 13, 2009Date of Patent: October 23, 2012Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Tetsuji Togawa, Toshio Watanabe, Hiroyuki Yano, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama
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Patent number: 7883394Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.Type: GrantFiled: July 31, 2008Date of Patent: February 8, 2011Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Tetsuji Togawa, Toshio Watanabe, Hiroyuki Yano, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama
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Publication number: 20100255757Abstract: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.Type: ApplicationFiled: June 21, 2010Publication date: October 7, 2010Inventors: Atsushi SHIGETA, Gen Toyota, Hiroyuki Yano, Kunio Oishi, Kenya Ito, Masayuki Nakanishi, Kenji Yamaguchi
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Patent number: 7767472Abstract: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.Type: GrantFiled: August 1, 2007Date of Patent: August 3, 2010Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Atsushi Shigeta, Gen Toyota, Hiroyuki Yano, Kunio Oishi, Kenya Ito, Masayuki Nakanishi, Kenji Yamaguchi
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Patent number: 7744445Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).Type: GrantFiled: October 12, 2005Date of Patent: June 29, 2010Assignees: Kabushiki Kaisha Toshiba, Ebara CorporationInventors: Takeo Kubota, Atsushi Shigeta, Gen Toyota, Tamami Takahashi, Daisaku Fukuoka, Kenya Ito
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Publication number: 20100062691Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.Type: ApplicationFiled: November 13, 2009Publication date: March 11, 2010Inventors: Tetsuji TOGAWA, Toshio Watanabe, Hiroyuki Yano, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama
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Publication number: 20090017730Abstract: A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).Type: ApplicationFiled: October 12, 2005Publication date: January 15, 2009Inventors: Takeo Kubota, Atsushi Shigeta, Gen Toyota, Tamami Takahashi, Daisaku Fukuoka, Kenya Ito
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Publication number: 20080318503Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.Type: ApplicationFiled: July 31, 2008Publication date: December 25, 2008Inventors: Tetsuji TOGAWA, Toshio Watanabe, Hiroyuki Yano, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama
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Patent number: 7419420Abstract: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring.Type: GrantFiled: December 26, 2003Date of Patent: September 2, 2008Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Tetsuji Togawa, Toshio Watanabe, Hiroyuki Yano, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama