Abstract: Providing a power control device of a simple structure which increases the reliability of a circuit as incorporated therein. A semiconductor component constituting a power control device comprises a semiconductor chip, atop of which a cathode and a gate are formed via an oxide film portion. The cathode comprises a pad portion, a fusion portion and a contact portion. The pad portion and the contact portion are interconnected by the fusion portion only. An anode is formed at the bottom of the semiconductor chip. With the flow of a fusing current through the fusion portion, the fusion portion is fused by heat generated therefrom whereby the current flow through the cathode and the anode is interrupted.